HONG KONG HAOCHIP TRADING CO., LIMITED

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    121-83-652-41-001101

    121-83-652-41-001101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    3,534 1.15
    RFQ
    121-83-652-41-001101

    Datasheet

    121 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-192-16-001101

    510-87-192-16-001101

    CONN SOCKET PGA 192POS GOLD

    Preci-Dip

    4,190 1.16
    RFQ
    510-87-192-16-001101

    Datasheet

    510 Bulk Active PGA 192 (16 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    14-822-90T

    14-822-90T

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    1,349 1.84
    RFQ
    14-822-90T

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    612-83-964-41-001101

    612-83-964-41-001101

    CONN IC DIP SOCKET 64POS GOLD

    Preci-Dip

    1,175 1.31
    RFQ
    612-83-964-41-001101

    Datasheet

    612 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-314-WGG

    ICA-314-WGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,829 -
    RFQ
    ICA-314-WGG

    Datasheet

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    116-87-328-41-013101

    116-87-328-41-013101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,622 1.16
    RFQ
    116-87-328-41-013101

    Datasheet

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-428-41-013101

    116-87-428-41-013101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    2,624 1.16
    RFQ
    116-87-428-41-013101

    Datasheet

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-316-CGG

    ICO-316-CGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    1,256 -
    RFQ
    ICO-316-CGG

    Datasheet

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    116-83-632-41-004101

    116-83-632-41-004101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    1,405 1.32
    RFQ
    116-83-632-41-004101

    Datasheet

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    16-3518-11H

    16-3518-11H

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    2,259 1.50
    RFQ
    16-3518-11H

    Datasheet

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    APA-316-T-P

    APA-316-T-P

    ADAPTER PLUG

    Samtec Inc.

    2,079 1.40
    RFQ
    APA-316-T-P

    Datasheet

    APA Bag Active - 16 (2 x 8) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    20-0508-20

    20-0508-20

    CONN SOCKET SIP 20POS GOLD

    Aries Electronics

    2,619 1.84
    RFQ
    20-0508-20

    Datasheet

    508 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    20-0508-30

    20-0508-30

    CONN SOCKET SIP 20POS GOLD

    Aries Electronics

    1,861 1.84
    RFQ
    20-0508-30

    Datasheet

    508 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    20-1508-20

    20-1508-20

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,445 1.84
    RFQ
    20-1508-20

    Datasheet

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    20-1508-30

    20-1508-30

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    3,643 1.84
    RFQ
    20-1508-30

    Datasheet

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    126-93-304-41-001000

    126-93-304-41-001000

    CONN IC DIP SOCKET 4POS GOLD

    Mill-Max Manufacturing Corp.

    3,882 1.51
    RFQ
    126-93-304-41-001000

    Datasheet

    126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-43-304-41-001000

    126-43-304-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,482 1.51
    RFQ
    126-43-304-41-001000

    Datasheet

    126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-83-648-41-007101

    116-83-648-41-007101

    CONN IC DIP SOCKET 48POS GOLD

    Preci-Dip

    4,764 1.22
    RFQ
    116-83-648-41-007101

    Datasheet

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-628-ZWTT-2

    ICA-628-ZWTT-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,375 -
    RFQ
    ICA-628-ZWTT-2

    Datasheet

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    7-1437532-6

    7-1437532-6

    CONN IC DIP SOCKET 40POS GOLD

    TE Connectivity AMP Connectors

    2,584 -
    RFQ
    7-1437532-6

    Datasheet

    500 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Polyester -55°C ~ 125°C
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