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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    22-6501-20

    22-6501-20

    CONN IC DIP SOCKET 22POS TIN

    Aries Electronics

    		 2,332 1.80
    RFQ
    		22-6501-20

    Datasheet

         		501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    22-6501-30

    22-6501-30

    CONN IC DIP SOCKET 22POS TIN

    Aries Electronics

    		 4,036 1.80
    RFQ
    		22-6501-30

    Datasheet

         		501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    09-0501-20

    09-0501-20

    CONN SOCKET SIP 9POS TIN

    Aries Electronics

    		 4,184 1.80
    RFQ
    		09-0501-20

    Datasheet

         		501 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    33-0511-10

    33-0511-10

    CONN SOCKET SIP 33POS TIN

    Aries Electronics

    		 3,815 1.80
    RFQ
    		33-0511-10

    Datasheet

         		511 Bulk Active SIP 33 (1 x 33) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    824-AG30D

    824-AG30D

    CONN IC DIP SOCKET 24POS GOLD

    TE Connectivity AMP Connectors

    		 1,521 1.42
    RFQ
    		824-AG30D

    Datasheet

         		800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
    14-823-90C

    14-823-90C

    IC SOCKET 14PIN VERT SCKT HORIZ

    Aries Electronics

    		 3,161 1.80
    RFQ

    -

    		 Vertisockets™ 800 - Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-3518-01

    16-3518-01

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    		 2,242 1.80
    RFQ
    		16-3518-01

    Datasheet

         		518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    16-6823-90T

    16-6823-90T

    CONN IC DIP SOCKET 16POS TIN

    Aries Electronics

    		 4,727 1.80
    RFQ
    		16-6823-90T

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    16-822-90T

    16-822-90T

    CONN IC DIP SOCKET 16POS TIN

    Aries Electronics

    		 3,908 1.80
    RFQ
    		16-822-90T

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    14-4820-90C

    14-4820-90C

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    		 4,362 1.80
    RFQ
    		14-4820-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-4823-90C

    14-4823-90C

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    		 1,087 1.80
    RFQ
    		14-4823-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-6820-90C

    14-6820-90C

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    		 3,347 1.80
    RFQ
    		14-6820-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-6822-90C

    14-6822-90C

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    		 4,477 1.80
    RFQ
    		14-6822-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-6823-90C

    14-6823-90C

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    		 3,342 1.80
    RFQ
    		14-6823-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-820-90C

    14-820-90C

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    		 2,280 1.80
    RFQ
    		14-820-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-822-90C

    14-822-90C

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    		 4,376 1.80
    RFQ
    		14-822-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    ICA-422-WGT-2

    ICA-422-WGT-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    		 2,041 -
    RFQ
    		ICA-422-WGT-2

    Datasheet

         		ICA Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    32-1518-11H

    32-1518-11H

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 4,075 1.80
    RFQ
    		32-1518-11H

    Datasheet

         		518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICF-640-TM-O

    ICF-640-TM-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    		 1,254 -
    RFQ
    		ICF-640-TM-O

    Datasheet

         		ICF Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    HLS-0120-T-11

    HLS-0120-T-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 1,046 -
    RFQ
    		HLS-0120-T-11

    Datasheet

         		HLS Tube Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
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