HONG KONG HAOCHIP TRADING CO., LIMITED

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    124-83-642-41-002101

    124-83-642-41-002101

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    1,540 1.21
    RFQ

    -

    124 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APA-316-T-C

    APA-316-T-C

    ADAPTER PLUG

    Samtec Inc.

    3,033 1.08
    RFQ
    APA-316-T-C

    Datasheet

    APA Bulk Active - 16 (2 x 8) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    146-83-648-41-036101

    146-83-648-41-036101

    CONN IC DIP SOCKET 48POS GOLD

    Preci-Dip

    1,545 1.10
    RFQ
    146-83-648-41-036101

    Datasheet

    146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    122-83-650-41-001101

    122-83-650-41-001101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    1,627 1.20
    RFQ
    122-83-650-41-001101

    Datasheet

    122 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    123-83-650-41-001101

    123-83-650-41-001101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    2,501 1.20
    RFQ
    123-83-650-41-001101

    Datasheet

    123 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    16-0503-20

    16-0503-20

    CONN SOCKET SIP 16POS GOLD

    Aries Electronics

    2,624 1.82
    RFQ
    16-0503-20

    Datasheet

    0503 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    16-0503-30

    16-0503-30

    CONN SOCKET SIP 16POS GOLD

    Aries Electronics

    4,617 1.82
    RFQ
    16-0503-30

    Datasheet

    0503 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    37-0518-00

    37-0518-00

    CONN SOCKET SIP 37POS GOLD

    Aries Electronics

    2,212 1.82
    RFQ
    37-0518-00

    Datasheet

    518 Bulk Active SIP 37 (1 x 37) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    40-0511-10

    40-0511-10

    CONN SOCKET SIP 40POS TIN

    Aries Electronics

    4,210 1.83
    RFQ
    40-0511-10

    Datasheet

    511 Bulk Active SIP 40 (1 x 40) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-6501-21

    10-6501-21

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    1,415 1.67
    RFQ
    10-6501-21

    Datasheet

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    10-6501-31

    10-6501-31

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    1,445 1.67
    RFQ
    10-6501-31

    Datasheet

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    116-83-648-41-009101

    116-83-648-41-009101

    CONN IC DIP SOCKET 48POS GOLD

    Preci-Dip

    1,980 1.33
    RFQ
    116-83-648-41-009101

    Datasheet

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APO-316-T-B

    APO-316-T-B

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,567 -
    RFQ
    APO-316-T-B

    Datasheet

    APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    116-93-304-41-006000

    116-93-304-41-006000

    CONN IC DIP SOCKET 4POS GOLD

    Mill-Max Manufacturing Corp.

    3,897 1.49
    RFQ
    116-93-304-41-006000

    Datasheet

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-304-41-006000

    116-43-304-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,781 1.49
    RFQ
    116-43-304-41-006000

    Datasheet

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-93-125-41-013000

    346-93-125-41-013000

    CONN SOCKET SIP 25POS GOLD

    Mill-Max Manufacturing Corp.

    3,217 0.99
    RFQ
    346-93-125-41-013000

    Datasheet

    346 Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-43-125-41-013000

    346-43-125-41-013000

    CONN SOCKET SIP 25POS GOLD

    Mill-Max Manufacturing Corp.

    4,743 0.99
    RFQ
    346-43-125-41-013000

    Datasheet

    346 Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APA-422-T-A1

    APA-422-T-A1

    ADAPTER PLUG

    Samtec Inc.

    1,063 1.09
    RFQ
    APA-422-T-A1

    Datasheet

    APA Bulk Active - 22 (2 x 11) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    214-99-632-01-670799

    214-99-632-01-670799

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    2,085 1.49
    RFQ

    -

    214 Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    214-44-632-01-670799

    214-44-632-01-670799

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    2,238 1.49
    RFQ

    -

    214 Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
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