HONG KONG HAOCHIP TRADING CO., LIMITED

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    24-C212-00

    24-C212-00

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    2,630 2.76
    RFQ
    24-C212-00

    Datasheet

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-C300-00

    24-C300-00

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    2,134 2.76
    RFQ
    24-C300-00

    Datasheet

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-9503-20

    20-9503-20

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,314 2.77
    RFQ
    20-9503-20

    Datasheet

    503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-9503-30

    20-9503-30

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    3,915 2.77
    RFQ
    20-9503-30

    Datasheet

    503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    64-9513-10

    64-9513-10

    CONN IC DIP SOCKET 64POS GOLD

    Aries Electronics

    3,631 2.16
    RFQ
    64-9513-10

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-71000-10

    16-71000-10

    CONN SOCKET SIP 16POS TIN

    Aries Electronics

    2,592 2.77
    RFQ
    16-71000-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-7415-10

    16-7415-10

    CONN SOCKET SIP 16POS TIN

    Aries Electronics

    4,094 2.77
    RFQ
    16-7415-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-7440-10

    16-7440-10

    CONN SOCKET SIP 16POS TIN

    Aries Electronics

    3,695 2.77
    RFQ
    16-7440-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-7500-10

    16-7500-10

    CONN SOCKET SIP 16POS TIN

    Aries Electronics

    1,195 2.77
    RFQ
    16-7500-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-7980-10

    16-7980-10

    CONN SOCKET SIP 16POS TIN

    Aries Electronics

    1,889 2.77
    RFQ
    16-7980-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    Total 4131 Record«Prev1... 198199200201202203204205...414Next»
    Search

    Search

    PRODUCT

    PRODUCT

    PHONE

    PHONE

    USER

    USER