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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    14-3508-202

    14-3508-202

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    		 1,871 2.11
    RFQ
    		14-3508-202

    Datasheet

         		508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-3508-302

    14-3508-302

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    		 2,694 2.11
    RFQ
    		14-3508-302

    Datasheet

         		508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    32-6501-20

    32-6501-20

    CONN IC DIP SOCKET 32POS TIN

    Aries Electronics

    		 4,814 2.11
    RFQ
    		32-6501-20

    Datasheet

         		501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    32-6501-30

    32-6501-30

    CONN IC DIP SOCKET 32POS TIN

    Aries Electronics

    		 3,275 2.11
    RFQ
    		32-6501-30

    Datasheet

         		501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    18-3501-21

    18-3501-21

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    		 4,932 2.11
    RFQ
    		18-3501-21

    Datasheet

         		501 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    23-0508-30

    23-0508-30

    CONN SOCKET SIP 23POS GOLD

    Aries Electronics

    		 1,383 2.12
    RFQ
    		23-0508-30

    Datasheet

         		508 Bulk Active SIP 23 (1 x 23) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    15-7350-10

    15-7350-10

    CONN SOCKET SIP 15POS TIN

    Aries Electronics

    		 3,503 2.71
    RFQ
    		15-7350-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    15-7450-10

    15-7450-10

    CONN SOCKET SIP 15POS TIN

    Aries Electronics

    		 1,810 2.71
    RFQ
    		15-7450-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    15-7500-10

    15-7500-10

    CONN SOCKET SIP 15POS TIN

    Aries Electronics

    		 1,539 2.71
    RFQ
    		15-7500-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    15-7540-10

    15-7540-10

    CONN SOCKET SIP 15POS TIN

    Aries Electronics

    		 1,267 2.71
    RFQ
    		15-7540-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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