HONG KONG HAOCHIP TRADING CO., LIMITED

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    30-0508-30

    30-0508-30

    CONN SOCKET SIP 30POS GOLD

    Aries Electronics

    3,094 2.75
    RFQ
    30-0508-30

    Datasheet

    508 Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    30-1508-20

    30-1508-20

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    1,409 2.75
    RFQ
    30-1508-20

    Datasheet

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    30-1508-30

    30-1508-30

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    4,763 2.75
    RFQ
    30-1508-30

    Datasheet

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    16-3508-202

    16-3508-202

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    2,589 2.06
    RFQ
    16-3508-202

    Datasheet

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-3508-302

    16-3508-302

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    1,656 2.06
    RFQ
    16-3508-302

    Datasheet

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-820-90T

    20-820-90T

    CONN IC DIP SOCKET 20POS TIN

    Aries Electronics

    3,513 2.06
    RFQ
    20-820-90T

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    14-8385-610C

    14-8385-610C

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    3,598 2.06
    RFQ
    14-8385-610C

    Datasheet

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    19-0503-20

    19-0503-20

    CONN SOCKET SIP 19POS GOLD

    Aries Electronics

    1,994 2.15
    RFQ
    19-0503-20

    Datasheet

    0503 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    19-0503-30

    19-0503-30

    CONN SOCKET SIP 19POS GOLD

    Aries Electronics

    3,560 2.15
    RFQ
    19-0503-30

    Datasheet

    0503 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    24-C182-00

    24-C182-00

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    4,673 2.76
    RFQ
    24-C182-00

    Datasheet

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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