Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Packaging | Product Status | Type | Package Cooled | Attachment Method | Shape | Length | Width | Diameter | Fin Height | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material | Material Finish |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
342948COPPER HEATSINK 70X69X14MM Boyd Laconia, LLC |
1,272 | 8.89 |
|
![]() Datasheet |
- | Tray | Active | Top Mount, Skived | BGA | Push Pin | Square, Fins | 2.717" (69.00mm) | 2.756" (70.00mm) | - | 0.551" (14.00mm) | - | 1.40°C/W @ 200 LFM | 5.60°C/W | Copper | AavSHIELD 3C |
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342945-COPPER SKIVFIN342945,REV03(GP) Boyd Laconia, LLC |
1,726 | - |
|
- |
- | Bulk | Active | Board Level | BGA, FPGA | Push Pin, Thermal Material | Square, Fins | 2.362" (60.00mm) | 2.362" (60.00mm) | - | 0.551" (14.00mm) | - | - | - | Copper | - |
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342947-COPPER SKIVFIN342947,REV02(GP) Boyd Laconia, LLC |
1,157 | - |
|
- |
- | Bulk | Active | Board Level | BGA, FPGA | Push Pin, Thermal Material | Rectangular, Fins | 2.323" (59.00mm) | 2.280" (57.91mm) | - | 0.433" (11.00mm) | - | - | - | Copper | - |
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342943-COPPER SKIVFIN342943 Boyd Laconia, LLC |
1,572 | - |
|
- |
- | Bulk | Active | Board Level | BGA, FPGA | Push Pin, Thermal Material | Square, Fins | 1.969" (50.00mm) | 1.969" (50.00mm) | - | 0.551" (14.00mm) | - | - | - | Copper | - |
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1101ATHM,10761A REV --G Boyd Laconia, LLC |
3,195 | - |
|
- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
342950COPPER HEATSINK 90X90X10MM Boyd Laconia, LLC |
1,204 | 10.96 |
|
![]() Datasheet |
- | Tray | Active | Top Mount, Skived | BGA | Push Pin | Square, Fins | 3.543" (90.00mm) | 3.543" (90.00mm) | - | 0.394" (10.00mm) | - | 1.30°C/W @ 200 LFM | 4.50°C/W | Copper | AavSHIELD 3C |
|
342946COPPER HEATSINK 60X60X22MM Boyd Laconia, LLC |
1,506 | 9.52 |
|
![]() Datasheet |
- | Tray | Active | Top Mount, Skived | BGA | Push Pin | Square, Fins | 2.362" (60.00mm) | 2.362" (60.00mm) | - | 0.866" (22.00mm) | - | 0.80°C/W @ 300 LFM | 7.20°C/W | Copper | AavSHIELD 3C |
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342950-COPPER SKIVFIN342950,REV02(GP) Boyd Laconia, LLC |
1,345 | - |
|
- |
- | Bulk | Active | Board Level | BGA, FPGA | Push Pin, Thermal Material | Square, Fins | 3.543" (90.00mm) | 3.543" (90.00mm) | - | 0.394" (10.00mm) | - | - | - | Copper | - |
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2207/PR11B-2 ASSYGHEAT SINK Boyd Laconia, LLC |
3,072 | 10.17 |
|
![]() Datasheet |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
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575803B00100GSTD,575803B00100G Boyd Laconia, LLC |
4,597 | - |
|
- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |