HONG KONG HAOCHIP TRADING CO., LIMITED

    Heat Sinks

    制造商 Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material 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    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material Finish
    342948

    342948

    COPPER HEATSINK 70X69X14MM

    Boyd Laconia, LLC

    1,272 8.89
    RFQ
    342948

    Datasheet

    - Tray Active Top Mount, Skived BGA Push Pin Square, Fins 2.717" (69.00mm) 2.756" (70.00mm) - 0.551" (14.00mm) - 1.40°C/W @ 200 LFM 5.60°C/W Copper AavSHIELD 3C
    342945-COPPER SKIVFIN

    342945-COPPER SKIVFIN

    342945,REV03(GP)

    Boyd Laconia, LLC

    1,726 -
    RFQ

    -

    - Bulk Active Board Level BGA, FPGA Push Pin, Thermal Material Square, Fins 2.362" (60.00mm) 2.362" (60.00mm) - 0.551" (14.00mm) - - - Copper -
    342947-COPPER SKIVFIN

    342947-COPPER SKIVFIN

    342947,REV02(GP)

    Boyd Laconia, LLC

    1,157 -
    RFQ

    -

    - Bulk Active Board Level BGA, FPGA Push Pin, Thermal Material Rectangular, Fins 2.323" (59.00mm) 2.280" (57.91mm) - 0.433" (11.00mm) - - - Copper -
    342943-COPPER SKIVFIN

    342943-COPPER SKIVFIN

    342943

    Boyd Laconia, LLC

    1,572 -
    RFQ

    -

    - Bulk Active Board Level BGA, FPGA Push Pin, Thermal Material Square, Fins 1.969" (50.00mm) 1.969" (50.00mm) - 0.551" (14.00mm) - - - Copper -
    1101A

    1101A

    THM,10761A REV --G

    Boyd Laconia, LLC

    3,195 -
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - -
    342950

    342950

    COPPER HEATSINK 90X90X10MM

    Boyd Laconia, LLC

    1,204 10.96
    RFQ
    342950

    Datasheet

    - Tray Active Top Mount, Skived BGA Push Pin Square, Fins 3.543" (90.00mm) 3.543" (90.00mm) - 0.394" (10.00mm) - 1.30°C/W @ 200 LFM 4.50°C/W Copper AavSHIELD 3C
    342946

    342946

    COPPER HEATSINK 60X60X22MM

    Boyd Laconia, LLC

    1,506 9.52
    RFQ
    342946

    Datasheet

    - Tray Active Top Mount, Skived BGA Push Pin Square, Fins 2.362" (60.00mm) 2.362" (60.00mm) - 0.866" (22.00mm) - 0.80°C/W @ 300 LFM 7.20°C/W Copper AavSHIELD 3C
    342950-COPPER SKIVFIN

    342950-COPPER SKIVFIN

    342950,REV02(GP)

    Boyd Laconia, LLC

    1,345 -
    RFQ

    -

    - Bulk Active Board Level BGA, FPGA Push Pin, Thermal Material Square, Fins 3.543" (90.00mm) 3.543" (90.00mm) - 0.394" (10.00mm) - - - Copper -
    2207/PR11B-2 ASSYG

    2207/PR11B-2 ASSYG

    HEAT SINK

    Boyd Laconia, LLC

    3,072 10.17
    RFQ
    2207/PR11B-2 ASSYG

    Datasheet

    - Bulk Active - - - - - - - - - - - - -
    575803B00100G

    575803B00100G

    STD,575803B00100G

    Boyd Laconia, LLC

    4,597 -
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - -
    Total 748 Record«Prev1... 5354555657585960...75Next»
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