HONG KONG HAOCHIP TRADING CO., LIMITED

    Heat Sinks

    制造商 Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material Finish



























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material Finish
    3749241-PAH14010-P0

    3749241-PAH14010-P0

    3749241-PAH14010-P0

    Boyd Laconia, LLC

    3,328 -
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - -
    2207/PR11B ASSY

    2207/PR11B ASSY

    HEAT SINK

    Boyd Laconia, LLC

    1,740 5.97
    RFQ
    2207/PR11B ASSY

    Datasheet

    - Bulk Active - - - - - - - - - - - - -
    342940

    342940

    COPPER HEATSINK 38.5X37.6X14MM

    Boyd Laconia, LLC

    4,355 6.46
    RFQ
    342940

    Datasheet

    - Tray Active Top Mount, Skived BGA Push Pin Rectangular, Fins 1.480" (37.59mm) 1.516" (38.50mm) - 0.551" (14.00mm) - 2.60°C/W @ 200 LFM 15.90°C/W Copper AavSHIELD 3C
    647061

    647061

    INTEL XEON CPU COOLER 1U

    Boyd Laconia, LLC

    2,060 7.62
    RFQ
    647061

    Datasheet

    - Tray Active Top Mount, Zipper Fin Intel® Xeon® CPU Bolt On Rectangular, Fins 4.252" (108.00mm) 3.071" (78.00mm) - 1.004" (25.50mm) - - - Copper -
    342945

    342945

    COPPER HEATSINK 60X60X14MM

    Boyd Laconia, LLC

    1,440 9.19
    RFQ
    342945

    Datasheet

    - Tray Active Top Mount, Skived BGA Push Pin Square, Fins 2.362" (60.00mm) 2.362" (60.00mm) - 0.551" (14.00mm) - 1.70°C/W @ 200 LFM 7.00°C/W Copper AavSHIELD 3C
    484675 REV K

    484675 REV K

    484675 REV K

    Boyd Laconia, LLC

    3,663 -
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - -
    342943

    342943

    COPPER HEATSINK 50X50X14MM

    Boyd Laconia, LLC

    3,127 7.47
    RFQ
    342943

    Datasheet

    - Tray Active Top Mount, Skived BGA Push Pin Square, Fins 1.969" (50.00mm) 1.969" (50.00mm) - 0.551" (14.00mm) - 2.10°C/W @ 200 LFM 8.90°C/W Copper AavSHIELD 3C
    342947

    342947

    COPPER HEATSINK 57.9X59X11MM

    Boyd Laconia, LLC

    3,982 7.66
    RFQ
    342947

    Datasheet

    - Tray Active Top Mount, Skived BGA Push Pin Rectangular, Fins 2.323" (59.00mm) 2.280" (57.91mm) - 0.433" (11.00mm) - 1.90°C/W @ 200 LFM 7.70°C/W Copper AavSHIELD 3C
    193500B00000,MOD

    193500B00000,MOD

    STD,193500B00000,MOD

    Boyd Laconia, LLC

    4,994 -
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - -
    647064

    647064

    INTEL XEON CPU COOLER 2U

    Boyd Laconia, LLC

    4,023 7.18
    RFQ
    647064

    Datasheet

    - Tray Active Top Mount, Zipper Fin Intel® Xeon® CPU Bolt On Rectangular, Fins 4.252" (108.00mm) 3.071" (78.00mm) - 2.519" (64.00mm) - - - Copper -
    Total 748 Record«Prev1... 5253545556575859...75Next»
    Search

    Search

    PRODUCT

    PRODUCT

    PHONE

    PHONE

    USER

    USER