HONG KONG HAOCHIP TRADING CO., LIMITED

    Heat Sinks

    制造商 Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material 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    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material Finish
    EA-330-H125-T710

    EA-330-H125-T710

    STD,EA-330-H125-T710, CLIP ATTAC

    Boyd Laconia, LLC

    1,489 -
    RFQ

    -

    EA-330 Bulk Active Top Mount BGA, FPGA Clip Square, Fins 1.299" (32.99mm) 1.299" (32.99mm) - 0.492" (12.50mm) - 12.80°C/W @ 200 LFM 31.40°C/W Aluminum Black Anodized
    530801B05100G

    530801B05100G

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    4,593 1.29
    RFQ
    530801B05100G

    Datasheet

    - Bulk Active Board Level, Vertical TO-218, TO-247 Bolt On and PC Pin Rectangular, Fins 1.840" (46.74mm) 0.490" (12.44mm) - 1.750" (44.45mm) 4.0W @ 30°C 1.00°C/W @ 700 LFM 6.30°C/W Aluminum Black Anodized
    576602D00000G

    576602D00000G

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    1,035 1.29
    RFQ
    576602D00000G

    Datasheet

    - Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 0.950" (24.13mm) 1.000" (25.40mm) - 0.500" (12.70mm) 4.0W @ 70°C 9.00°C/W @ 200 LFM 16.60°C/W Aluminum Tin
    532802B02500G

    532802B02500G

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    3,166 1.27
    RFQ
    532802B02500G

    Datasheet

    - Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 2.500" (63.50mm) 1.650" (41.91mm) - 1.000" (25.40mm) 6.0W @ 30°C 2.00°C/W @ 200 LFM 4.20°C/W Aluminum Black Anodized
    EA-330-H095-T710

    EA-330-H095-T710

    STD,EA-330-H095-T710, CLIP ATTAC

    Boyd Laconia, LLC

    4,170 -
    RFQ

    -

    EA-330 Bulk Active Top Mount BGA, FPGA Clip Square, Fins 1.299" (32.99mm) 1.299" (32.99mm) - 0.374" (9.50mm) - 16.50°C/W @ 200 LFM 37.30°C/W Aluminum Black Anodized
    11-5602-51

    11-5602-51

    11-5602-51 REV F

    Boyd Laconia, LLC

    1,825 -
    RFQ

    -

    - Bulk Active Top Mount BGA Push Pin Square, Fins 1.575" (40.00mm) 1.575" (40.00mm) - 0.453" (11.50mm) - - 3.70°C/W Brass Black Anodized
    6380B

    6380B

    THM,17500B-1G REV H

    Boyd Laconia, LLC

    2,802 -
    RFQ

    -

    - Bulk Active Board Level, Vertical TO-218, TO-220 Bolt On and PC Pin Rectangular, Fins 1.650" (41.91mm) 1.000" (25.40mm) - 1.000" (25.40mm) 2.0W @ 20°C 3.5°C/W @ 200 LFM 6.80°C/W Aluminum Black Anodized
    2286B

    2286B

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    3,858 1.47
    RFQ
    2286B

    Datasheet

    - Bulk Active Board Level BGA Thermal Tape, Adhesive (Not Included) Square 0.790" (20.07mm) 0.790" (20.07mm) - 0.155" (3.94mm) 1.0W @ 40°C 20.00°C/W @ 200 LFM - Aluminum Black Anodized
    EA-350-H245-T710

    EA-350-H245-T710

    EA-350-H245-T710

    Boyd Laconia, LLC

    2,410 -
    RFQ

    -

    EA-350 Bulk Active Top Mount BGA, FPGA Clip Square, Fins 1.378" (35.00mm) 1.378" (35.00mm) - 0.965" (24.50mm) - 7.30°C/W @ 200 LFM 17.90°C/W Aluminum Black Anodized
    2281B

    2281B

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    3,020 1.29
    RFQ
    2281B

    Datasheet

    - Bulk Active - - - - - - - - - - - Aluminum Black Anodized
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