HONG KONG HAOCHIP TRADING CO., LIMITED

    Heat Sinks

    制造商 Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material 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    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material Finish
    2601006001 REV C

    2601006001 REV C

    2601006001, REV C

    Boyd Laconia, LLC

    1,222 -
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - -
    EA-270-H225-T710

    EA-270-H225-T710

    EA-270-H225-T710

    Boyd Laconia, LLC

    3,534 -
    RFQ

    -

    EA-270 Bulk Active Top Mount BGA, FPGA Clip Square, Fins 1.063" (27.00mm) 1.063" (27.00mm) - 0.886" (22.50mm) - 9.60°C/W @ 200 LFM 29.00°C/W Aluminum Black Anodized
    592902B03400G

    592902B03400G

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    3,170 1.13
    RFQ
    592902B03400G

    Datasheet

    Channel 5900 Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 0.980" (24.89mm) 0.942" (23.93mm) - 0.500" (12.70mm) 1.0W @ 20°C 6.00°C/W @ 400 LFM 17.90°C/W Aluminum Black Anodized
    501403B00500G

    501403B00500G

    STD,501403B00500G

    Boyd Laconia, LLC

    1,981 -
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - -
    2328BG

    2328BG

    HEAT SINK

    Boyd Laconia, LLC

    4,742 1.12
    RFQ
    2328BG

    Datasheet

    - Bulk Active - - - - - - - - - - - - -
    15570B-TTG REV I, (6032B-T

    15570B-TTG REV I, (6032B-T

    THM,15570B-TTG REV I, (6032B-T

    Boyd Laconia, LLC

    2,516 -
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - -
    EA-270-H245-T710

    EA-270-H245-T710

    EA-270-H245-T710

    Boyd Laconia, LLC

    3,397 -
    RFQ

    -

    EA-270 Bulk Active Top Mount BGA, FPGA Clip Square, Fins 1.063" (27.00mm) 1.063" (27.00mm) - 0.965" (24.50mm) - 9.00°C/W @ 200 LFM 27.60°C/W Aluminum Black Anodized
    2292BG

    2292BG

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    4,709 1.22
    RFQ
    2292BG

    Datasheet

    - Bulk Active Board Level BGA Thermal Tape, Adhesive (Not Included) Cylindrical - - 0.300" (7.62mm) ID, 1.125" (28.57mm) OD - 1.5W @ 40°C 8.00°C/W @ 400 LFM - Aluminum Black Anodized
    506115B00015G

    506115B00015G

    STD,506115B00015G

    Boyd Laconia, LLC

    1,498 -
    RFQ

    -

    - Bulk Active Board Level - Bolt On Rectangular, Fins 2.250" (57.15mm) 2.000" (50.80mm) - 0.375" (9.52mm) - - - Aluminum Black Anodized
    2333BG

    2333BG

    HEATSINK

    Boyd Laconia, LLC

    2,820 1.14
    RFQ
    2333BG

    Datasheet

    - Bulk Active - - - - - - - - - - - - -
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