HONG KONG HAOCHIP TRADING CO., LIMITED

    Solder

    制造商 Series Packaging Product Status Type Composition Diameter Melting Point Flux Type Wire Gauge Mesh Type Process Form Shelf Life Shelf Life Start Storage/Refrigeration Temperature





























































































































































































































































































































































































































































































































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    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Composition Diameter Melting Point Flux Type Wire Gauge Mesh Type Process Form Shelf Life Shelf Life Start Storage/Refrigeration Temperature
    SMD291SNL250T4

    SMD291SNL250T4

    SLDR PST NO-CLEAN SAC305 T4 250G

    Chip Quik Inc.

    2,179 13.19
    RFQ
    SMD291SNL250T4

    Datasheet

    - Bulk Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) No-Clean - 4 Lead Free Jar, 8.8 oz (250g) 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
    SMD4300SNL250T4

    SMD4300SNL250T4

    SLDR PST WATR SOL SAC305 T4 250G

    Chip Quik Inc.

    1,088 13.59
    RFQ
    SMD4300SNL250T4

    Datasheet

    CHIPQUIK® SMD4300 Bulk Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) No-Clean, Water Soluble - 4 Lead Free Jar, 8.8 oz (250g) 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
    TS391SNL250

    TS391SNL250

    THERMALLY STABLE SOLDER PASTE NO

    Chip Quik Inc.

    2,114 13.99
    RFQ
    TS391SNL250

    Datasheet

    - Bulk Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) No-Clean - 4 Lead Free Jar, 8.8 oz (250g) 12 Months Date of Manufacture 68°F ~ 77°F (20°C ~ 25°C)
    SMDLTLFP250T3

    SMDLTLFP250T3

    SOLDER PASTE SN42/BI58 250G

    Chip Quik Inc.

    1,142 13.99
    RFQ
    SMDLTLFP250T3

    Datasheet

    - Bulk Active Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) - 281°F (138°C) No-Clean - 3 Lead Free Jar, 8.8 oz (250g) 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
    SMDLTLFP250T4

    SMDLTLFP250T4

    SOLDER PASTE LOW TEMP T4 250G

    Chip Quik Inc.

    3,453 16.79
    RFQ
    SMDLTLFP250T4

    Datasheet

    - Bulk Active Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) - 281°F (138°C) No-Clean - 4 Lead Free Jar, 8.8 oz (250g) 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
    TS391LT250

    TS391LT250

    THERMALLY STABLE SOLDER PASTE NO

    Chip Quik Inc.

    2,489 16.99
    RFQ
    TS391LT250

    Datasheet

    - Bulk Active Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) - 281°F (138°C) No-Clean - 4 Lead Free Jar, 8.8 oz (250g) 12 Months Date of Manufacture 68°F ~ 77°F (20°C ~ 25°C)
    NCSWLF.031 1LB

    NCSWLF.031 1LB

    LF SOLDER WIRE 96.5/3/0.5 TIN/SI

    Chip Quik Inc.

    3,265 17.51
    RFQ
    NCSWLF.031 1LB

    Datasheet

    - Bulk Active Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 0.031" (0.79mm) 422 ~ 428°F (217 ~ 220°C) No-Clean 20 AWG, 21 SWG - Lead Free Spool, 1 lb (454 g) - - -
    24-6337-6401

    24-6337-6401

    SOLDER WATER SOLUABLE 24AWG 1LB

    Kester Solder

    3,588 14.34
    RFQ
    24-6337-6401

    Datasheet

    331 Spool Active Wire Solder Sn63Pb37 (63/37) 0.020" (0.51mm) 361°F (183°C) Water Soluble 24 AWG, 25 SWG - Leaded Spool, 1 lb (454 g) 36 Months Date of Manufacture 50°F ~ 104°F (10°C ~ 40°C)
    SMD291AX250T5

    SMD291AX250T5

    SOLDER PASTE SN63/PB37 250G T5

    Chip Quik Inc.

    1,619 18.19
    RFQ
    SMD291AX250T5

    Datasheet

    - Bulk Active Solder Paste Sn63Pb37 (63/37) - 361°F (183°C) No-Clean - 5 Leaded Jar, 8.8 oz (250g) 12 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
    24-6040-9713

    24-6040-9713

    SOLDER FLUX-CORED/285 .031" 1LB

    Kester Solder

    1,008 11.75
    RFQ
    24-6040-9713

    Datasheet

    285 Bulk Active Wire Solder Sn60Pb40 (60/40) 0.031" (0.79mm) 361 ~ 374°F (183 ~ 190°C) Rosin Mildly Activated (RMA) 20 AWG, 22 SWG - Leaded Spool, 1 lb (454 g) 36 Months Date of Manufacture 50°F ~ 104°F (10°C ~ 40°C)
    SMD4300AX250T5

    SMD4300AX250T5

    SOLDER PASTE SN63/PB37 250G T5

    Chip Quik Inc.

    3,403 19.79
    RFQ
    SMD4300AX250T5

    Datasheet

    CHIPQUIK® SMD4300 Bulk Active Solder Paste Sn63Pb37 (63/37) - 361°F (183°C) No-Clean, Water Soluble - 5 Leaded Jar, 8.8 oz (250g) 12 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
    91-7482-3340

    91-7482-3340

    INNOLOT 2.2%/278 .040 250 G ROBO

    Kester Solder

    3,501 14.40
    RFQ
    91-7482-3340

    Datasheet

    - Box Active Wire Solder - 0.040" (1.02mm) - No-Clean - - Lead Free Spool - - -
    24-6040-0010

    24-6040-0010

    SOLDER RA 60/40 24AWG 1LB

    Kester Solder

    1,865 11.80
    RFQ
    24-6040-0010

    Datasheet

    44 Spool Active Wire Solder Sn60Pb40 (60/40) 0.020" (0.51mm) 361 ~ 374°F (183 ~ 190°C) Rosin Activated (RA) 24 AWG, 25 SWG - Leaded Spool, 1 lb (454 g) 36 Months Date of Manufacture 50°F ~ 104°F (10°C ~ 40°C)
    SMD291SNL250T5

    SMD291SNL250T5

    SOLDER PASTE SAC305 250G T5

    Chip Quik Inc.

    1,001 20.79
    RFQ
    SMD291SNL250T5

    Datasheet

    - Bulk Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) No-Clean - 5 Lead Free Jar, 8.8 oz (250g) 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
    WS991SNL500T4

    WS991SNL500T4

    SOLDER PASTE THERMALLY STABLE WS

    Chip Quik Inc.

    4,309 19.42
    RFQ
    WS991SNL500T4

    Datasheet

    CHIPQUIK® Bulk Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423°F (217°C) Water Soluble - 4 Lead Free Jar, 17.64 oz (500g) 6 Months Date of Manufacture -
    TS991SNL500T4

    TS991SNL500T4

    SOLDER PASTE THERMALLY STABLE NC

    Chip Quik Inc.

    3,585 19.42
    RFQ
    TS991SNL500T4

    Datasheet

    CHIPQUIK® Bulk Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423°F (217°C) No-Clean - 4 Lead Free Jar, 17.64 oz (500g) 12 Months Date of Manufacture -
    70-4825-0904

    70-4825-0904

    NP560 SN96.5AG3.0CU0.5 T4 100 GM

    Kester Solder

    2,351 19.08
    RFQ
    70-4825-0904

    Datasheet

    NP560 Bulk Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 424°F (217 ~ 218°C) No-Clean - 4 Lead Free Syringe, 3.53 oz (100g) 12 Months Date of Manufacture 32°F ~ 50°F (0°C ~ 10°C)
    24-7150-8800

    24-7150-8800

    SOLDER FLUX-CORED/245 .031" 1LB

    Kester Solder

    4,416 15.59
    RFQ
    24-7150-8800

    Datasheet

    245 Bulk Active Wire Solder Sn62Pb36Ag2 (62/36/2) 0.031" (0.79mm) 354°F (179°C) No-Clean 20 AWG, 22 SWG - Leaded Spool, 1 lb (454 g) - - 50°F ~ 104°F (10°C ~ 40°C)
    70-1002-0510

    70-1002-0510

    SOLDER 500G JAR, SN63/PB37

    Kester Solder

    2,598 26.16
    RFQ
    70-1002-0510

    Datasheet

    HydroMark 531 Bulk Active Solder Paste Sn63Pb37 (63/37) - 361°F (183°C) Water Soluble - 3 Leaded Jar, 17.64 oz (500g) 6 Months Date of Manufacture 32°F ~ 50°F (0°C ~ 10°C)
    1993881

    1993881

    LOCTITEGC10SAC305T4 885 52U 500g

    Harimatec Inc.

    4,511 28.44
    RFQ
    1993881

    Datasheet

    LOCTITE® GC 10 Bulk Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423°F (217°C) No-Clean - - Lead Free Jar, 17.64 oz (500g) 12 Months Date of Manufacture 41°F ~ 77°F (5°C ~ 25°C)
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