HONG KONG HAOCHIP TRADING CO., LIMITED

    Solder

    制造商 Series Packaging Product Status Type Composition Diameter Melting Point Flux Type Wire Gauge Mesh Type Process Form Shelf Life Shelf Life Start Storage/Refrigeration Temperature





























































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Composition Diameter Melting Point Flux Type Wire Gauge Mesh Type Process Form Shelf Life Shelf Life Start Storage/Refrigeration Temperature
    WC96L2031E

    WC96L2031E

    SAC 305 NO CLEAN 8 OZ .031 DIA.

    Canfield Technologies

    2,005 40.72
    RFQ

    -

    - Spool Active Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 0.031" (0.79mm) 423 ~ 424°F (217 ~ 218°C) No-Clean 20 AWG, 22 SWG - Lead Free Spool, 8 oz (227g), 1/2 lb 24 Months Date of Manufacture 50°F ~ 104°F (10°C ~ 40°C)
    RCBLF22701062P

    RCBLF22701062P

    BLF 227 ROSIN FLUX 1 LB. 062 DIA

    Canfield Technologies

    2,923 44.80
    RFQ

    -

    - Spool Active Wire Solder BLF 227 (99.17Sn/.8Cu/.03Ni) 0.062" (1.57mm) 440°F (227°C) Rosin Activated (RA) 14 AWG, 16 SWG - Lead Free Spool, 1 lb (453.59g) 24 Months Date of Manufacture 50°F ~ 104°F (10°C ~ 40°C)
    RC96L2020CQPJ

    RC96L2020CQPJ

    SAC 305 ROSIN FLUX 8 OZ. .020 DI

    Canfield Technologies

    3,604 45.24
    RFQ

    -

    - Spool Active Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 0.020" (0.51mm) 423 ~ 424°F (217 ~ 218°C) Rosin Activated (RA) 24 AWG, 25 SWG - Lead Free Spool, 8 oz (227g), 1/2 lb 24 Months Date of Manufacture 50°F ~ 104°F (10°C ~ 40°C)
    SW SN63 .062 1#

    SW SN63 .062 1#

    SN63PB37 .062 DIA 1 lb. Spool

    Amerway Inc

    100 -
    RFQ

    -

    - Tape & Box (TB) Active Wire Solder Sn63Pb37 (63/37) 0.062" (1.57mm) 361°F (183°C) - 14 AWG - Leaded Spool, 1 lb (454 g) - Date of Manufacture Room Temperature
    CCBLF22701031P

    CCBLF22701031P

    BLF 227 NO CLEAN FLUX 1 LB. 031D

    Canfield Technologies

    4,250 47.14
    RFQ

    -

    - Spool Active Wire Solder BLF 227 (99.17Sn/.8Cu/.03Ni) 0.031" (0.79mm) 440°F (227°C) No-Clean 20 AWG, 22 SWG - Lead Free Spool, 1 lb (453.59g) 24 Months Date of Manufacture 50°F ~ 104°F (10°C ~ 40°C)
    RCBLF22701031P

    RCBLF22701031P

    BLF 227 ROSIN FLUX 1 LB. 031DIA

    Canfield Technologies

    1,440 47.14
    RFQ

    -

    - Spool Active Wire Solder BLF 227 (99.17Sn/.8Cu/.03Ni) 0.031" (0.79mm) 440°F (227°C) Rosin Activated (RA) 20 AWG, 22 SWG - Lead Free Spool, 1 lb (453.59g) 24 Months Date of Manufacture 50°F ~ 104°F (10°C ~ 40°C)
    JPAGSC0501P

    JPAGSC0501P

    SIL CAN 5 BRAZING ALLOY

    Canfield Technologies

    1,449 51.44
    RFQ

    -

    - Tube Active Brazing Rod 5% Ag 89% Cu, 6% Phos - 1190/1495°F (1190/1495°F) - - - Lead Free Tube, 1 lb (454g) - - 50°F ~ 104°F (10°C ~ 40°C)
    RCBLF22701020P

    RCBLF22701020P

    BLF227 ROSIN FLUX 1 LB. .020 DIA

    Canfield Technologies

    1,924 54.70
    RFQ

    -

    - Spool Active Wire Solder BLF 227 (99.17Sn/.8Cu/.03Ni) 0.020" (0.51mm) 440°F (227°C) Rosin Activated (RA) 24 AWG, 25 SWG - Lead Free Spool, 1 lb (453.59g) 24 Months Date of Manufacture 50°F ~ 104°F (10°C ~ 40°C)
    SW SN60 .062 1#

    SW SN60 .062 1#

    Sn60Pb40 .062 dia 1 lb. spool

    Amerway Inc

    100 -
    RFQ

    -

    - Tape & Box (TB) Active Wire Solder Sn60Pb40 (60/40) 0.062" (1.57mm) 361°F (183°C) - 14 AWG - Leaded Spool, 1 lb (454 g) - Date of Manufacture Room Temperature
    SW SN60 .125 1#

    SW SN60 .125 1#

    60% TIN, 40% LEAD, SOLID WIRE WA

    Amerway Inc

    100 -
    RFQ

    -

    - Tape & Box (TB) Active - - - - - - - - - - - -
    SW SN97CU3 .125

    SW SN97CU3 .125

    97% Tin, 3% Copper, .125 dia on

    Amerway Inc

    100 -
    RFQ

    -

    - Tape & Box (TB) Active - - - - - - - - - - - -
    CCBLF22701062

    CCBLF22701062

    BLF 227 NO CLEAN 1 LB. 062 CORE

    Canfield Technologies

    100 69.06
    RFQ

    -

    - Spool Active Wire Solder BLF 227 (99.17Sn/.8Cu/.03Ni) 0.062" (1.57mm) 440°F (227°C) No-Clean 14 AWG, 16 SWG - Lead Free Spool, 1 lb (453.59g) 24 Months Date of Manufacture 50°F ~ 104°F (10°C ~ 40°C)
    WC9601062PSAC

    WC9601062PSAC

    SAC 305 WATER SOLUBLE FLUX 1 LB.

    Canfield Technologies

    4,275 69.06
    RFQ

    -

    - Spool Active Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 0.062" (1.57mm) 423 ~ 424°F (217 ~ 218°C) Water Soluble 14 AWG, 16 SWG - Lead Free Spool, 1 lb (453.59g) 24 Months Date of Manufacture 50°F ~ 104°F (10°C ~ 40°C)
    CC9601031PAG3

    CC9601031PAG3

    SAC 305 NO CLEAN 1 LB. .031 DIA

    Canfield Technologies

    2,603 71.51
    RFQ

    -

    - Spool Active Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 0.031" (0.79mm) 423 ~ 424°F (217 ~ 218°C) No-Clean 20 AWG, 22 SWG - Lead Free Spool, 1 lb (453.59g) 24 Months Date of Manufacture 50°F ~ 104°F (10°C ~ 40°C)
    WC9601031P

    WC9601031P

    SAC 305 WATER SOLUBLE FLUX 1 LB.

    Canfield Technologies

    3,189 -
    RFQ

    -

    - Spool Active Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 0.031" (0.79mm) 423 ~ 424°F (217 ~ 218°C) Water Soluble 20 AWG, 22 SWG - Lead Free Spool, 1 lb (453.59g) 24 Months Date of Manufacture 50°F ~ 104°F (10°C ~ 40°C)
    CWSnCu0.7Ni RA3% .062 1#

    CWSnCu0.7Ni RA3% .062 1#

    CW SnCu0.7Ni WRAP 3% 0.062 1# SP

    Amerway Inc

    100 -
    RFQ

    -

    - Tape & Box (TB) Active Wire Solder Sn99.244Cu0.7 (Ni0.05/Ge0.006) 0.062" (1.57mm) 441°F (227°C) Rosin Activated (RA) 14 AWG - Lead Free Spool, 1 lb (454 g) 60 Months Date of Manufacture Room Temperature
    CWSnCu0.7Ni NCCW2.2% .062 1#

    CWSnCu0.7Ni NCCW2.2% .062 1#

    CW SnCu0.7Ni NCCW 2.2% 0.062 1#

    Amerway Inc

    100 -
    RFQ

    -

    - Tape & Box (TB) Active Wire Solder Sn99.244Cu0.7 (Ni0.05/Ge0.006) 0.062" (1.57mm) 441°F (227°C) No-Clean 14 AWG - Lead Free Spool, 1 lb (454 g) 60 Months Date of Manufacture Room Temperature
    CWSnCu0.7Ni RMA3% .062 1#

    CWSnCu0.7Ni RMA3% .062 1#

    CW SnCu0.7Ni WRMAP 3% 0.062 1# S

    Amerway Inc

    100 -
    RFQ

    -

    - Tape & Box (TB) Active Wire Solder Sn99.244Cu0.7 (Ni0.05/Ge0.006) 0.062" (1.57mm) 441°F (227°C) Rosin Mildly Activated (RMA) 14 AWG - Lead Free Spool, 1 lb (454 g) 60 Months Date of Manufacture Room Temperature
    CWSnCu0.7Ni RA3% .032 1#

    CWSnCu0.7Ni RA3% .032 1#

    CW SnCu0.7Ni WRAP 3% 0.032 1# SP

    Amerway Inc

    100 -
    RFQ

    -

    - Tape & Box (TB) Active Wire Solder Sn99.244Cu0.7 (Ni0.05/Ge0.006) 0.032" (0.81mm) 441°F (227°C) Rosin Activated (RA) 20 AWG - Lead Free Spool, 1 lb (454 g) 60 Months Date of Manufacture Room Temperature
    CWSnCu0.7Ni RMA3% .032 1#

    CWSnCu0.7Ni RMA3% .032 1#

    CW SnCu0.7Ni WRMAP 3% 0.032 1# S

    Amerway Inc

    100 -
    RFQ

    -

    - Tape & Box (TB) Active Wire Solder Sn99.244Cu0.7 (Ni0.05/Ge0.006) 0.032" (0.81mm) 441°F (227°C) Rosin Mildly Activated (RMA) 20 AWG - Lead Free Spool, 1 lb (454 g) 60 Months Date of Manufacture Room Temperature
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