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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    110-43-650-41-105000

    110-43-650-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,444 3.13
    RFQ
    		110-43-650-41-105000

    Datasheet

         		110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-950-41-105000

    110-43-950-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,027 3.13
    RFQ
    		110-43-950-41-105000

    Datasheet

         		110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-328-41-801000

    110-43-328-41-801000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,803 3.03
    RFQ
    		110-43-328-41-801000

    Datasheet

         		110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-93-328-41-801000

    110-93-328-41-801000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 1,934 3.03
    RFQ
    		110-93-328-41-801000

    Datasheet

         		110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APH-0512-G-T

    APH-0512-G-T

    APH-0512-G-T

    Samtec Inc.

    		 1,265 -
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1912-G-T

    APH-1912-G-T

    APH-1912-G-T

    Samtec Inc.

    		 3,520 -
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0212-G-T

    APH-0212-G-T

    APH-0212-G-T

    Samtec Inc.

    		 4,808 -
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1612-G-T

    APH-1612-G-T

    APH-1612-G-T

    Samtec Inc.

    		 4,479 -
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0912-G-T

    APH-0912-G-T

    APH-0912-G-T

    Samtec Inc.

    		 2,971 -
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0412-G-T

    APH-0412-G-T

    APH-0412-G-T

    Samtec Inc.

    		 4,419 -
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    116-41-650-41-003000

    116-41-650-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,181 3.19
    RFQ
    		116-41-650-41-003000

    Datasheet

         		116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-650-41-003000

    116-91-650-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,651 3.19
    RFQ
    		116-91-650-41-003000

    Datasheet

         		116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-11-652-41-001000

    110-11-652-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,713 3.37
    RFQ
    		110-11-652-41-001000

    Datasheet

         		110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0318-T-31

    HLS-0318-T-31

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 1,611 -
    RFQ
    		HLS-0318-T-31

    Datasheet

         		HLS Tube Active SIP 54 (3 x 18) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    104-11-636-41-770000

    104-11-636-41-770000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,919 3.05
    RFQ
    		104-11-636-41-770000

    Datasheet

         		104 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-13-318-41-001000

    123-13-318-41-001000

    CONN IC DIP SOCKET 18POS GOLD

    Mill-Max Manufacturing Corp.

    		 1,760 3.06
    RFQ
    		123-13-318-41-001000

    Datasheet

         		123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    32-3575-10

    32-3575-10

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    		 4,045 3.88
    RFQ
    		32-3575-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    123-11-322-41-001000

    123-11-322-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 1,943 3.43
    RFQ
    		123-11-322-41-001000

    Datasheet

         		123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-11-422-41-001000

    123-11-422-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,584 3.43
    RFQ
    		123-11-422-41-001000

    Datasheet

         		123 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    27-0508-21

    27-0508-21

    CONN SOCKET SIP 27POS GOLD

    Aries Electronics

    		 4,088 3.97
    RFQ
    		27-0508-21

    Datasheet

         		508 Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
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