HONG KONG HAOCHIP TRADING CO., LIMITED86+15817455051 HONG KONG HAOCHIP TRADING CO., LIMITEDKyle@hkhaochip.com
HONG KONG HAOCHIP TRADING CO., LIMITEDUpload BOM
    HONG KONG HAOCHIP TRADING CO., LIMITED
    All Categories
    English 简体中文 Русский 日本語 한국어 Spanish
    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    614-43-428-41-001000

    614-43-428-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 1,353 3.38
    RFQ
    		614-43-428-41-001000

    Datasheet

         		614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-628-41-001000

    614-43-628-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 3,444 3.38
    RFQ
    		614-43-628-41-001000

    Datasheet

         		614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    40-9503-20

    40-9503-20

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 4,158 3.76
    RFQ
    		40-9503-20

    Datasheet

         		503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-9503-30

    40-9503-30

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 1,461 3.76
    RFQ
    		40-9503-30

    Datasheet

         		503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-3508-212

    18-3508-212

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    		 1,833 3.76
    RFQ
    		18-3508-212

    Datasheet

         		508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    614-93-432-31-012000

    614-93-432-31-012000

    SOCKET CARRIER LOWPRO .400 32POS

    Mill-Max Manufacturing Corp.

    		 3,779 3.03
    RFQ
    		614-93-432-31-012000

    Datasheet

         		614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-432-31-012000

    614-43-432-31-012000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 4,398 3.03
    RFQ
    		614-43-432-31-012000

    Datasheet

         		614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    40-9513-11H

    40-9513-11H

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 1,652 3.93
    RFQ
    		40-9513-11H

    Datasheet

         		Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    117-41-656-41-005000

    117-41-656-41-005000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,067 3.43
    RFQ
    		117-41-656-41-005000

    Datasheet

         		117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 56 (2 x 28) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    117-91-656-41-005000

    117-91-656-41-005000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,381 3.43
    RFQ
    		117-91-656-41-005000

    Datasheet

         		117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 56 (2 x 28) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-47-648-41-007000

    116-47-648-41-007000

    STANDRD SOLDRTL

    Mill-Max Manufacturing Corp.

    		 2,703 3.16
    RFQ
    		116-47-648-41-007000

    Datasheet

         		116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    121-11-328-41-001000

    121-11-328-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,372 3.41
    RFQ
    		121-11-328-41-001000

    Datasheet

         		121 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    121-11-428-41-001000

    121-11-428-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,750 3.41
    RFQ
    		121-11-428-41-001000

    Datasheet

         		121 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    121-11-628-41-001000

    121-11-628-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,636 3.41
    RFQ
    		121-11-628-41-001000

    Datasheet

         		121 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    31-7400-10

    31-7400-10

    CONN SOCKET SIP 31POS TIN

    Aries Electronics

    		 1,932 3.84
    RFQ
    		31-7400-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 31 (1 x 31) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    31-7440-10

    31-7440-10

    CONN SOCKET SIP 31POS TIN

    Aries Electronics

    		 1,753 3.84
    RFQ
    		31-7440-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 31 (1 x 31) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    31-7500-10

    31-7500-10

    CONN SOCKET SIP 31POS TIN

    Aries Electronics

    		 1,967 3.84
    RFQ
    		31-7500-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 31 (1 x 31) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-3508-212

    16-3508-212

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    		 3,578 3.84
    RFQ
    		16-3508-212

    Datasheet

         		508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    16-3508-312

    16-3508-312

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    		 2,987 3.84
    RFQ
    		16-3508-312

    Datasheet

         		508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    114-41-950-41-117000

    114-41-950-41-117000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,204 3.06
    RFQ
    		114-41-950-41-117000

    Datasheet

         		114 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 675676677678679680681682...955Next»
    HONG KONG HAOCHIP TRADING CO., LIMITED
    Help you to save your cost and time.
    HONG KONG HAOCHIP TRADING CO., LIMITED
    Reliable package for your goods.
    HONG KONG HAOCHIP TRADING CO., LIMITED
    Fast reliable delivery to save time.
    HONG KONG HAOCHIP TRADING CO., LIMITED
    Quality premium after-sale service.
    Search

    Search

     PRODUCT

    PRODUCT

     PHONE

    PHONE

     USER

    USER
    HONG KONG HAOCHIP TRADING CO., LIMITED
    HONG KONG HAOCHIP TRADING CO., LIMITED
    Kyle@hkhaochip.com