HONG KONG HAOCHIP TRADING CO., LIMITED86+15817455051 HONG KONG HAOCHIP TRADING CO., LIMITEDKyle@hkhaochip.com
HONG KONG HAOCHIP TRADING CO., LIMITEDUpload BOM
    HONG KONG HAOCHIP TRADING CO., LIMITED
    All Categories
    English 简体中文 Русский 日本語 한국어 Spanish
    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    126-93-316-41-001000

    126-93-316-41-001000

    CONN IC DIP SOCKET 16POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,675 3.02
    RFQ
    		126-93-316-41-001000

    Datasheet

         		126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-43-316-41-001000

    126-43-316-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,435 3.02
    RFQ
    		126-43-316-41-001000

    Datasheet

         		126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APO-640-T-R

    APO-640-T-R

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 1,151 -
    RFQ
    		APO-640-T-R

    Datasheet

         		APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    612-43-210-41-004000

    612-43-210-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 3,448 2.69
    RFQ
    		612-43-210-41-004000

    Datasheet

         		612 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-93-210-41-004000

    612-93-210-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 4,791 2.69
    RFQ
    		612-93-210-41-004000

    Datasheet

         		612 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    14-3508-311

    14-3508-311

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    		 4,609 3.25
    RFQ
    		14-3508-311

    Datasheet

         		508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    28-6501-21

    28-6501-21

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    		 3,671 3.01
    RFQ
    		28-6501-21

    Datasheet

         		501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    28-6501-31

    28-6501-31

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    		 3,532 3.01
    RFQ
    		28-6501-31

    Datasheet

         		501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    123-91-322-41-001000

    123-91-322-41-001000

    SOCKET IC OPEN 3 LVL .300 22POS

    Mill-Max Manufacturing Corp.

    		 1,646 2.97
    RFQ

    -

    		 123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-91-422-41-001000

    123-91-422-41-001000

    SOCKET IC OPEN 3 LVL .400 22POS

    Mill-Max Manufacturing Corp.

    		 4,635 2.97
    RFQ

    -

    		 123 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-41-322-41-001000

    123-41-322-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 1,236 2.97
    RFQ
    		123-41-322-41-001000

    Datasheet

         		123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-41-422-41-001000

    123-41-422-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,276 2.97
    RFQ
    		123-41-422-41-001000

    Datasheet

         		123 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    23-0503-21

    23-0503-21

    CONN SOCKET SIP 23POS GOLD

    Aries Electronics

    		 3,673 3.78
    RFQ
    		23-0503-21

    Datasheet

         		0503 Bulk Active SIP 23 (1 x 23) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    111-93-432-41-001000

    111-93-432-41-001000

    CONN IC DIP SOCKET 32POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,535 2.96
    RFQ
    		111-93-432-41-001000

    Datasheet

         		111 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-43-432-41-001000

    111-43-432-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 1,659 2.96
    RFQ
    		111-43-432-41-001000

    Datasheet

         		111 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-44-650-41-003000

    115-44-650-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,690 2.96
    RFQ
    		115-44-650-41-003000

    Datasheet

         		115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-11-210-41-001000

    612-11-210-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 1,475 2.68
    RFQ
    		612-11-210-41-001000

    Datasheet

         		612 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) - - Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-47-952-41-001000

    110-47-952-41-001000

    STANDRD SOLDRTL

    Mill-Max Manufacturing Corp.

    		 4,305 2.95
    RFQ
    		110-47-952-41-001000

    Datasheet

         		110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0407-G-10

    HLS-0407-G-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 4,099 -
    RFQ
    		HLS-0407-G-10

    Datasheet

         		HLS Bulk Active SIP 28 (4 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    68-PGM11033-10H

    68-PGM11033-10H

    CONN SOCKET PGA GOLD

    Aries Electronics

    		 2,582 3.25
    RFQ
    		68-PGM11033-10H

    Datasheet

         		PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    Total 19086 Record«Prev1... 590591592593594595596597...955Next»
    HONG KONG HAOCHIP TRADING CO., LIMITED
    Help you to save your cost and time.
    HONG KONG HAOCHIP TRADING CO., LIMITED
    Reliable package for your goods.
    HONG KONG HAOCHIP TRADING CO., LIMITED
    Fast reliable delivery to save time.
    HONG KONG HAOCHIP TRADING CO., LIMITED
    Quality premium after-sale service.
    Search

    Search

     PRODUCT

    PRODUCT

     PHONE

    PHONE

     USER

    USER
    HONG KONG HAOCHIP TRADING CO., LIMITED
    HONG KONG HAOCHIP TRADING CO., LIMITED
    Kyle@hkhaochip.com