HONG KONG HAOCHIP TRADING CO., LIMITED

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    116-93-420-41-008000

    116-93-420-41-008000

    CONN IC DIP SOCKET 20POS GOLD

    Mill-Max Manufacturing Corp.

    4,844 2.98
    RFQ
    116-93-420-41-008000

    Datasheet

    116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-320-41-008000

    116-43-320-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,401 2.98
    RFQ
    116-43-320-41-008000

    Datasheet

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    714-93-120-31-018000

    714-93-120-31-018000

    CONN SOCKET SIP 20POS GOLD

    Mill-Max Manufacturing Corp.

    1,475 2.90
    RFQ
    714-93-120-31-018000

    Datasheet

    714 Tube Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-322-31-002000

    614-41-322-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,173 3.00
    RFQ
    614-41-322-31-002000

    Datasheet

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-422-31-002000

    614-41-422-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,438 3.00
    RFQ
    614-41-422-31-002000

    Datasheet

    614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-322-31-002000

    614-91-322-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,673 3.00
    RFQ
    614-91-322-31-002000

    Datasheet

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-422-31-002000

    614-91-422-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,050 3.00
    RFQ
    614-91-422-31-002000

    Datasheet

    614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    25-7350-10

    25-7350-10

    CONN SOCKET SIP 25POS TIN

    Aries Electronics

    3,231 3.24
    RFQ
    25-7350-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    25-7390-10

    25-7390-10

    CONN SOCKET SIP 25POS TIN

    Aries Electronics

    2,007 3.24
    RFQ
    25-7390-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    25-7435-10

    25-7435-10

    CONN SOCKET SIP 25POS TIN

    Aries Electronics

    3,344 3.24
    RFQ
    25-7435-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    25-7450-10

    25-7450-10

    CONN SOCKET SIP 25POS TIN

    Aries Electronics

    1,698 3.24
    RFQ
    25-7450-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    25-7500-10

    25-7500-10

    CONN SOCKET SIP 25POS TIN

    Aries Electronics

    1,459 3.24
    RFQ
    25-7500-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    25-7590-10

    25-7590-10

    CONN SOCKET SIP 25POS TIN

    Aries Electronics

    1,203 3.24
    RFQ
    25-7590-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    25-7625-10

    25-7625-10

    CONN SOCKET SIP 25POS TIN

    Aries Electronics

    4,639 3.24
    RFQ
    25-7625-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    25-7677-10

    25-7677-10

    CONN SOCKET SIP 25POS TIN

    Aries Electronics

    2,584 3.24
    RFQ
    25-7677-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    25-7700-10

    25-7700-10

    CONN SOCKET SIP 25POS TIN

    Aries Electronics

    2,005 3.24
    RFQ
    25-7700-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    25-7750-10

    25-7750-10

    CONN SOCKET SIP 25POS TIN

    Aries Electronics

    1,273 3.24
    RFQ
    25-7750-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    25-7770-10

    25-7770-10

    CONN SOCKET SIP 25POS TIN

    Aries Electronics

    3,351 3.24
    RFQ
    25-7770-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    25-7787-10

    25-7787-10

    CONN SOCKET SIP 25POS TIN

    Aries Electronics

    3,935 3.24
    RFQ
    25-7787-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    25-7846-10

    25-7846-10

    CONN SOCKET SIP 25POS TIN

    Aries Electronics

    4,624 3.24
    RFQ
    25-7846-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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