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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    317-43-115-41-005000

    317-43-115-41-005000

    CONN SKT STRIP

    Mill-Max Manufacturing Corp.

    		 3,232 2.82
    RFQ
    		317-43-115-41-005000

    Datasheet

         		317 Bulk Active SIP 15 (1 x 15) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    24-6501-31

    24-6501-31

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    		 2,549 2.70
    RFQ
    		24-6501-31

    Datasheet

         		501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    32-6820-90C

    32-6820-90C

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 2,051 3.44
    RFQ
    		32-6820-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    32-6822-90C

    32-6822-90C

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 1,610 3.44
    RFQ
    		32-6822-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    32-6823-90C

    32-6823-90C

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 4,895 3.44
    RFQ
    		32-6823-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    122-11-210-41-001000

    122-11-210-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,645 2.45
    RFQ
    		122-11-210-41-001000

    Datasheet

         		122 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-83-084-10-001112

    614-83-084-10-001112

    CONN SOCKET PGA 84POS GOLD

    Preci-Dip

    		 1,542 2.06
    RFQ
    		614-83-084-10-001112

    Datasheet

         		614 Bulk Active PGA 84 (10 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-83-084-10-031112

    614-83-084-10-031112

    CONN SOCKET PGA 84POS GOLD

    Preci-Dip

    		 2,773 2.06
    RFQ
    		614-83-084-10-031112

    Datasheet

         		614 Bulk Active PGA 84 (10 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    612-11-310-41-001000

    612-11-310-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 4,242 2.46
    RFQ
    		612-11-310-41-001000

    Datasheet

         		612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) - - Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-11-322-41-001000

    110-11-322-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,892 2.67
    RFQ
    		110-11-322-41-001000

    Datasheet

         		110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-11-422-41-001000

    110-11-422-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 1,732 2.67
    RFQ
    		110-11-422-41-001000

    Datasheet

         		110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    122-13-306-41-001000

    122-13-306-41-001000

    CONN IC DIP SOCKET 6POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,985 2.75
    RFQ
    		122-13-306-41-001000

    Datasheet

         		122 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    30-9503-20

    30-9503-20

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    		 1,729 3.44
    RFQ
    		30-9503-20

    Datasheet

         		503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    30-9503-30

    30-9503-30

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    		 3,691 3.44
    RFQ
    		30-9503-30

    Datasheet

         		503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    32-822-90C

    32-822-90C

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 4,267 3.44
    RFQ
    		32-822-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    32-823-90C

    32-823-90C

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 1,266 3.44
    RFQ
    		32-823-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    HLS-0412-T-2

    HLS-0412-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 4,527 -
    RFQ
    		HLS-0412-T-2

    Datasheet

         		HLS Bulk Active SIP 48 (4 x 12) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    116-93-314-41-007000

    116-93-314-41-007000

    CONN IC DIP SOCKET 14POS GOLD

    Mill-Max Manufacturing Corp.

    		 1,837 2.75
    RFQ
    		116-93-314-41-007000

    Datasheet

         		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-314-41-007000

    116-43-314-41-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,607 2.75
    RFQ
    		116-43-314-41-007000

    Datasheet

         		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    25-0501-21

    25-0501-21

    CONN SOCKET SIP 25POS GOLD

    Aries Electronics

    		 2,524 3.49
    RFQ
    		25-0501-21

    Datasheet

         		501 Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
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