HONG KONG HAOCHIP TRADING CO., LIMITED

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    APH-1226-T-R

    APH-1226-T-R

    APH-1226-T-R

    Samtec Inc.

    1,904 -
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0728-T-T

    APH-0728-T-T

    APH-0728-T-T

    Samtec Inc.

    2,864 -
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0328-T-T

    APH-0328-T-T

    APH-0328-T-T

    Samtec Inc.

    3,610 -
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1128-T-T

    APH-1128-T-T

    APH-1128-T-T

    Samtec Inc.

    4,457 -
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0726-T-R

    APH-0726-T-R

    APH-0726-T-R

    Samtec Inc.

    2,458 -
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1228-T-T

    APH-1228-T-T

    APH-1228-T-T

    Samtec Inc.

    1,917 -
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0326-T-R

    APH-0326-T-R

    APH-0326-T-R

    Samtec Inc.

    1,211 -
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0228-T-T

    APH-0228-T-T

    APH-0228-T-T

    Samtec Inc.

    3,305 -
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1826-T-R

    APH-1826-T-R

    APH-1826-T-R

    Samtec Inc.

    3,891 -
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1328-T-T

    APH-1328-T-T

    APH-1328-T-T

    Samtec Inc.

    4,542 -
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1726-T-R

    APH-1726-T-R

    APH-1726-T-R

    Samtec Inc.

    2,035 -
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    121-13-210-41-001000

    121-13-210-41-001000

    CONN IC DIP SOCKET 10POS GOLD

    Mill-Max Manufacturing Corp.

    3,553 2.44
    RFQ
    121-13-210-41-001000

    Datasheet

    121 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    317-91-119-41-005000

    317-91-119-41-005000

    CONN SKT SNG

    Mill-Max Manufacturing Corp.

    2,659 2.80
    RFQ
    317-91-119-41-005000

    Datasheet

    317 Bulk Active SIP 19 (1 x 19) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-642-41-001000

    110-91-642-41-001000

    CONN IC DIP SOCKET 42POS GOLD

    Mill-Max Manufacturing Corp.

    1,635 2.68
    RFQ
    110-91-642-41-001000

    Datasheet

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-41-642-41-001000

    110-41-642-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,198 2.68
    RFQ
    110-41-642-41-001000

    Datasheet

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    28-3575-10

    28-3575-10

    CONN IC DIP SOCKET ZIF 28POS GLD

    Aries Electronics

    2,085 3.47
    RFQ
    28-3575-10

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    28-6575-10

    28-6575-10

    CONN IC DIP SOCKET ZIF 28POS TIN

    Aries Electronics

    3,833 3.47
    RFQ
    28-6575-10

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    117-47-628-41-005000

    117-47-628-41-005000

    STANDRD SOLDRTL

    Mill-Max Manufacturing Corp.

    3,908 2.74
    RFQ
    117-47-628-41-005000

    Datasheet

    117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    40-0508-20

    40-0508-20

    CONN SOCKET SIP 40POS GOLD

    Aries Electronics

    3,044 3.43
    RFQ
    40-0508-20

    Datasheet

    508 Bulk Active SIP 40 (1 x 40) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    40-0508-30

    40-0508-30

    CONN SOCKET SIP 40POS GOLD

    Aries Electronics

    2,498 3.43
    RFQ
    40-0508-30

    Datasheet

    508 Bulk Active SIP 40 (1 x 40) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
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