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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    114-47-324-41-117000

    114-47-324-41-117000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    		 3,387 2.71
    RFQ
    		114-47-324-41-117000

    Datasheet

         		114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-47-424-41-117000

    114-47-424-41-117000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    		 4,800 2.71
    RFQ
    		114-47-424-41-117000

    Datasheet

         		114 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-47-624-41-117000

    114-47-624-41-117000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    		 4,841 2.71
    RFQ
    		114-47-624-41-117000

    Datasheet

         		114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    104-13-310-41-770000

    104-13-310-41-770000

    CONN IC DIP SOCKET 10POS GOLD

    Mill-Max Manufacturing Corp.

    		 4,805 2.27
    RFQ
    		104-13-310-41-770000

    Datasheet

         		104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
    60-9513-11

    60-9513-11

    CONN IC DIP SOCKET 60POS GOLD

    Aries Electronics

    		 4,503 3.30
    RFQ
    		60-9513-11

    Datasheet

         		Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 60 (2 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    116-93-308-41-008000

    116-93-308-41-008000

    CONN IC DIP SOCKET 8POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,098 2.66
    RFQ
    		116-93-308-41-008000

    Datasheet

         		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-308-41-008000

    116-43-308-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,983 2.66
    RFQ
    		116-43-308-41-008000

    Datasheet

         		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-210-41-007000

    116-93-210-41-007000

    CONN IC DIP SOCKET 10POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,620 2.30
    RFQ
    		116-93-210-41-007000

    Datasheet

         		116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-210-41-007000

    116-43-210-41-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 1,154 2.30
    RFQ
    		116-43-210-41-007000

    Datasheet

         		116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-308-31-012000

    614-41-308-31-012000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 4,909 2.64
    RFQ
    		614-41-308-31-012000

    Datasheet

         		614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-308-31-012000

    614-91-308-31-012000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 4,083 2.64
    RFQ
    		614-91-308-31-012000

    Datasheet

         		614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    14-0501-31

    14-0501-31

    CONN SOCKET SIP 14POS GOLD

    Aries Electronics

    		 4,688 2.72
    RFQ
    		14-0501-31

    Datasheet

         		501 Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    346-93-149-41-013000

    346-93-149-41-013000

    CONN SOCKET SIP 49POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,191 1.79
    RFQ
    		346-93-149-41-013000

    Datasheet

         		346 Bulk Active SIP 49 (1 x 49) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-43-149-41-013000

    346-43-149-41-013000

    CONN SOCKET SIP 49POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,891 1.79
    RFQ
    		346-43-149-41-013000

    Datasheet

         		346 Bulk Active SIP 49 (1 x 49) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    146-41-314-41-012000

    146-41-314-41-012000

    CONN SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,883 2.65
    RFQ
    		146-41-314-41-012000

    Datasheet

         		146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    146-91-314-41-012000

    146-91-314-41-012000

    CONN SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,744 2.65
    RFQ
    		146-91-314-41-012000

    Datasheet

         		146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-304-61-001000

    116-43-304-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 1,073 2.38
    RFQ

    -

    		 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-304-61-001000

    116-93-304-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,130 2.38
    RFQ

    -

    		 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-308-31-002000

    614-41-308-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 4,432 2.68
    RFQ
    		614-41-308-31-002000

    Datasheet

         		614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-308-31-002000

    614-91-308-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 4,772 2.68
    RFQ
    		614-91-308-31-002000

    Datasheet

         		614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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