HONG KONG HAOCHIP TRADING CO., LIMITED

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    110-41-324-41-605000

    110-41-324-41-605000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,425 2.58
    RFQ
    110-41-324-41-605000

    Datasheet

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-41-624-41-605000

    110-41-624-41-605000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,560 2.58
    RFQ
    110-41-624-41-605000

    Datasheet

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-324-41-605000

    110-91-324-41-605000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,525 2.58
    RFQ
    110-91-324-41-605000

    Datasheet

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-624-41-605000

    110-91-624-41-605000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,948 2.58
    RFQ
    110-91-624-41-605000

    Datasheet

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-43-308-11-480000

    605-43-308-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    2,163 2.66
    RFQ
    605-43-308-11-480000

    Datasheet

    605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-13-314-10-001000

    110-13-314-10-001000

    CONN IC DIP SOCKET 14POS GOLD

    Mill-Max Manufacturing Corp.

    2,971 2.52
    RFQ
    110-13-314-10-001000

    Datasheet

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7), 4 Loaded 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    714-43-138-31-018000

    714-43-138-31-018000

    CONN SOCKET SIP 38POS GOLD

    Mill-Max Manufacturing Corp.

    3,366 2.05
    RFQ
    714-43-138-31-018000

    Datasheet

    714 Bulk Active SIP 38 (1 x 38) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    317-91-113-41-005000

    317-91-113-41-005000

    CONN SKT SNG

    Mill-Max Manufacturing Corp.

    2,920 2.75
    RFQ
    317-91-113-41-005000

    Datasheet

    317 Bulk Active SIP 13 (1 x 13) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-47-210-41-001000

    123-47-210-41-001000

    STANDARD WIRE WRAP DBL SKT

    Mill-Max Manufacturing Corp.

    3,500 2.30
    RFQ
    123-47-210-41-001000

    Datasheet

    123 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    24-6822-90C

    24-6822-90C

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    3,740 2.72
    RFQ
    24-6822-90C

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    110-44-304-61-001000

    110-44-304-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,203 2.20
    RFQ

    -

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-43-306-41-003000

    612-43-306-41-003000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    3,793 2.71
    RFQ
    612-43-306-41-003000

    Datasheet

    612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-93-306-41-003000

    612-93-306-41-003000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    4,358 2.71
    RFQ
    612-93-306-41-003000

    Datasheet

    612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-91-324-41-003000

    115-91-324-41-003000

    SOCKET IC OPEN LOWPRO .300 24POS

    Mill-Max Manufacturing Corp.

    1,412 2.69
    RFQ

    -

    115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Thermoplastic -55°C ~ 125°C
    115-91-624-41-003000

    115-91-624-41-003000

    SOCKET IC OPEN LOWPRO .600 24POS

    Mill-Max Manufacturing Corp.

    4,986 2.69
    RFQ

    -

    115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Thermoplastic -55°C ~ 125°C
    115-41-324-41-003000

    115-41-324-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,696 2.69
    RFQ
    115-41-324-41-003000

    Datasheet

    115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-41-624-41-003000

    115-41-624-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,523 2.69
    RFQ
    115-41-624-41-003000

    Datasheet

    115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-310-41-001000

    614-41-310-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,525 2.27
    RFQ
    614-41-310-41-001000

    Datasheet

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-310-41-001000

    614-91-310-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,057 2.27
    RFQ
    614-91-310-41-001000

    Datasheet

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    8-1437504-3

    8-1437504-3

    CONN TRANSIST TO-3 3POS TIN

    TE Connectivity AMP Connectors

    3,712 -
    RFQ

    -

    8080 Bulk Obsolete Transistor, TO-3 3 (Oval) - Tin 200.0µin (5.08µm) Beryllium Copper Chassis Mount Closed Frame Solder - Tin 200.0µin (5.08µm) Beryllium Copper Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
    Total 19086 Record«Prev1... 499500501502503504505506...955Next»
    Search

    Search

    PRODUCT

    PRODUCT

    PHONE

    PHONE

    USER

    USER