HONG KONG HAOCHIP TRADING CO., LIMITED

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    APH-0606-G-R

    APH-0606-G-R

    APH-0606-G-R

    Samtec Inc.

    1,685 -
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1106-G-R

    APH-1106-G-R

    APH-1106-G-R

    Samtec Inc.

    4,732 -
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1606-G-R

    APH-1606-G-R

    APH-1606-G-R

    Samtec Inc.

    1,603 -
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1306-G-R

    APH-1306-G-R

    APH-1306-G-R

    Samtec Inc.

    4,822 -
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0806-G-R

    APH-0806-G-R

    APH-0806-G-R

    Samtec Inc.

    2,301 -
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1206-G-R

    APH-1206-G-R

    APH-1206-G-R

    Samtec Inc.

    4,040 -
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0706-G-R

    APH-0706-G-R

    APH-0706-G-R

    Samtec Inc.

    4,295 -
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    HLS-0307-G-12

    HLS-0307-G-12

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,357 -
    RFQ
    HLS-0307-G-12

    Datasheet

    HLS Tube Active SIP 21 (3 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    1735315-4

    1735315-4

    CONN SOCKET PGA ZIF 939POS GOLD

    TE Connectivity AMP Connectors

    3,898 -
    RFQ

    -

    - Tray Obsolete PGA, ZIF (ZIP) 939 (31 x 31) 0.050" (1.27mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 15.0µin (0.38µm) Copper Alloy Thermoplastic -
    13-0501-20

    13-0501-20

    CONN SOCKET SIP 13POS TIN

    Aries Electronics

    1,423 2.04
    RFQ
    13-0501-20

    Datasheet

    501 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    13-0501-30

    13-0501-30

    CONN SOCKET SIP 13POS TIN

    Aries Electronics

    2,419 2.04
    RFQ
    13-0501-30

    Datasheet

    501 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-3513-10H

    40-3513-10H

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    2,826 2.04
    RFQ
    40-3513-10H

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    ICA-632-ZWGT-3

    ICA-632-ZWGT-3

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    1,875 -
    RFQ
    ICA-632-ZWGT-3

    Datasheet

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    HLS-0120-G-38

    HLS-0120-G-38

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,896 -
    RFQ
    HLS-0120-G-38

    Datasheet

    HLS Tube Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    210-47-306-41-001000

    210-47-306-41-001000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    4,857 2.31
    RFQ
    210-47-306-41-001000

    Datasheet

    210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    117-43-448-41-005000

    117-43-448-41-005000

    CONN IC DIP SOCKET 48POS GOLD

    Mill-Max Manufacturing Corp.

    2,855 1.53
    RFQ
    117-43-448-41-005000

    Datasheet

    117 Tube Active DIP, 0.4" (10.16mm) Row Spacing 48 (2 x 24) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    14-0501-21

    14-0501-21

    CONN SOCKET SIP 14POS GOLD

    Aries Electronics

    3,595 2.72
    RFQ
    14-0501-21

    Datasheet

    501 Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    24-4518-01

    24-4518-01

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    2,408 2.72
    RFQ
    24-4518-01

    Datasheet

    518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    20-6820-90C

    20-6820-90C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,253 2.72
    RFQ
    20-6820-90C

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-6822-90C

    20-6822-90C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    1,042 2.72
    RFQ
    20-6822-90C

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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