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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    18-3501-21

    18-3501-21

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    		 4,932 2.11
    RFQ
    		18-3501-21

    Datasheet

         		501 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    110-93-304-61-001000

    110-93-304-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 1,836 2.24
    RFQ

    -

    		 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    23-0508-30

    23-0508-30

    CONN SOCKET SIP 23POS GOLD

    Aries Electronics

    		 1,383 2.12
    RFQ
    		23-0508-30

    Datasheet

         		508 Bulk Active SIP 23 (1 x 23) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    210-44-306-41-001000

    210-44-306-41-001000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    		 4,408 2.30
    RFQ
    		210-44-306-41-001000

    Datasheet

         		210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-99-306-41-001000

    210-99-306-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,892 2.30
    RFQ
    		210-99-306-41-001000

    Datasheet

         		210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-83-168-17-001101

    510-83-168-17-001101

    CONN SOCKET PGA 168POS GOLD

    Preci-Dip

    		 2,236 1.66
    RFQ
    		510-83-168-17-001101

    Datasheet

         		510 Bulk Active PGA 168 (17 x 17) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    15-7350-10

    15-7350-10

    CONN SOCKET SIP 15POS TIN

    Aries Electronics

    		 3,503 2.71
    RFQ
    		15-7350-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    15-7450-10

    15-7450-10

    CONN SOCKET SIP 15POS TIN

    Aries Electronics

    		 1,810 2.71
    RFQ
    		15-7450-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    15-7500-10

    15-7500-10

    CONN SOCKET SIP 15POS TIN

    Aries Electronics

    		 1,539 2.71
    RFQ
    		15-7500-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    15-7540-10

    15-7540-10

    CONN SOCKET SIP 15POS TIN

    Aries Electronics

    		 1,267 2.71
    RFQ
    		15-7540-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    15-7635-10

    15-7635-10

    CONN SOCKET SIP 15POS TIN

    Aries Electronics

    		 4,719 2.71
    RFQ
    		15-7635-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    15-7695-10

    15-7695-10

    CONN SOCKET SIP 15POS TIN

    Aries Electronics

    		 2,792 2.71
    RFQ
    		15-7695-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    15-7850-10

    15-7850-10

    CONN SOCKET SIP 15POS TIN

    Aries Electronics

    		 2,805 2.71
    RFQ
    		15-7850-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-6810-90TWR

    10-6810-90TWR

    CONN IC DIP SOCKET 10POS TIN

    Aries Electronics

    		 4,649 2.03
    RFQ
    		10-6810-90TWR

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    ICA-628-WGT-2

    ICA-628-WGT-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    		 1,830 -
    RFQ
    		ICA-628-WGT-2

    Datasheet

         		ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    24-6820-90C

    24-6820-90C

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    		 2,204 2.72
    RFQ
    		24-6820-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-6823-90C

    24-6823-90C

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    		 4,530 2.72
    RFQ
    		24-6823-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    APH-0906-G-R

    APH-0906-G-R

    APH-0906-G-R

    Samtec Inc.

    		 3,038 -
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1906-G-R

    APH-1906-G-R

    APH-1906-G-R

    Samtec Inc.

    		 4,603 -
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1006-G-R

    APH-1006-G-R

    APH-1006-G-R

    Samtec Inc.

    		 4,899 -
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
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