HONG KONG HAOCHIP TRADING CO., LIMITED

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    116-43-304-41-001000

    116-43-304-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,513 1.80
    RFQ
    116-43-304-41-001000

    Datasheet

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    40-6518-102

    40-6518-102

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    1,719 1.76
    RFQ
    40-6518-102

    Datasheet

    518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-87-648-41-004101

    116-87-648-41-004101

    CONN IC DIP SOCKET 48POS GOLD

    Preci-Dip

    4,055 1.62
    RFQ
    116-87-648-41-004101

    Datasheet

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APH-1812-T-R

    APH-1812-T-R

    APH-1812-T-R

    Samtec Inc.

    2,121 -
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1012-T-R

    APH-1012-T-R

    APH-1012-T-R

    Samtec Inc.

    1,439 -
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APO-624-T-J

    APO-624-T-J

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,833 -
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0212-T-R

    APH-0212-T-R

    APH-0212-T-R

    Samtec Inc.

    1,849 -
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1712-T-R

    APH-1712-T-R

    APH-1712-T-R

    Samtec Inc.

    4,746 -
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1212-T-R

    APH-1212-T-R

    APH-1212-T-R

    Samtec Inc.

    1,185 -
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0312-T-R

    APH-0312-T-R

    APH-0312-T-R

    Samtec Inc.

    2,687 -
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0412-T-R

    APH-0412-T-R

    APH-0412-T-R

    Samtec Inc.

    4,880 -
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    13-0503-21

    13-0503-21

    CONN SOCKET SIP 13POS GOLD

    Aries Electronics

    3,341 2.05
    RFQ
    13-0503-21

    Datasheet

    0503 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    13-0503-31

    13-0503-31

    CONN SOCKET SIP 13POS GOLD

    Aries Electronics

    1,065 2.05
    RFQ
    13-0503-31

    Datasheet

    0503 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    20-0503-30

    20-0503-30

    CONN SOCKET SIP 20POS GOLD

    Aries Electronics

    2,302 2.05
    RFQ
    20-0503-30

    Datasheet

    0503 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    20-3518-01

    20-3518-01

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    3,317 2.05
    RFQ
    20-3518-01

    Datasheet

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    20-4518-01

    20-4518-01

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,677 2.05
    RFQ
    20-4518-01

    Datasheet

    518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    24-C182-11

    24-C182-11

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    4,436 1.76
    RFQ
    24-C182-11

    Datasheet

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    24-C300-11

    24-C300-11

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    3,147 1.76
    RFQ
    24-C300-11

    Datasheet

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    ICO-624-SGG-L

    ICO-624-SGG-L

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    1,430 -
    RFQ
    ICO-624-SGG-L

    Datasheet

    ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICA-624-SGG-L

    ICA-624-SGG-L

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,707 -
    RFQ
    ICA-624-SGG-L

    Datasheet

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
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