HONG KONG HAOCHIP TRADING CO., LIMITED

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    10-7500-10

    10-7500-10

    CONN SOCKET SIP 10POS TIN

    Aries Electronics

    2,850 2.04
    RFQ
    10-7500-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-7550-10

    10-7550-10

    CONN SOCKET SIP 10POS TIN

    Aries Electronics

    1,881 2.04
    RFQ
    10-7550-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-7560-10

    10-7560-10

    CONN SOCKET SIP 10POS TIN

    Aries Electronics

    3,852 2.04
    RFQ
    10-7560-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-7600-10

    10-7600-10

    CONN SOCKET SIP 10POS TIN

    Aries Electronics

    4,620 2.04
    RFQ
    10-7600-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-7775-10

    10-7775-10

    CONN SOCKET SIP 10POS TIN

    Aries Electronics

    2,542 2.04
    RFQ
    10-7775-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-7860-10

    10-7860-10

    CONN SOCKET SIP 10POS TIN

    Aries Electronics

    1,850 2.04
    RFQ
    10-7860-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-7925-10

    10-7925-10

    CONN SOCKET SIP 10POS TIN

    Aries Electronics

    4,626 2.04
    RFQ
    10-7925-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-4810-90C

    10-4810-90C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    4,582 1.99
    RFQ
    10-4810-90C

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    10-6810-90C

    10-6810-90C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    4,030 2.04
    RFQ
    10-6810-90C

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICO-632-ZSGT

    ICO-632-ZSGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    1,405 -
    RFQ
    ICO-632-ZSGT

    Datasheet

    ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    116-83-432-41-013101

    116-83-432-41-013101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    1,934 1.52
    RFQ
    116-83-432-41-013101

    Datasheet

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0404-T-10

    HLS-0404-T-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,457 -
    RFQ
    HLS-0404-T-10

    Datasheet

    HLS Bulk Active SIP 16 (4 x 4) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    550-80-068-10-061101

    550-80-068-10-061101

    PGA SOLDER TAIL

    Preci-Dip

    3,485 1.42
    RFQ
    550-80-068-10-061101

    Datasheet

    550 Bulk Active PGA 68 (10 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    840-AG11D

    840-AG11D

    CONN IC DIP SOCKET 40POS GOLD

    TE Connectivity AMP Connectors

    3,054 -
    RFQ
    840-AG11D

    Datasheet

    800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C
    20-3501-21

    20-3501-21

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    3,814 2.04
    RFQ
    20-3501-21

    Datasheet

    501 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    20-3501-31

    20-3501-31

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,910 2.04
    RFQ
    20-3501-31

    Datasheet

    501 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    36-6501-20

    36-6501-20

    CONN IC DIP SOCKET 36POS TIN

    Aries Electronics

    4,107 2.04
    RFQ
    36-6501-20

    Datasheet

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    36-6501-30

    36-6501-30

    CONN IC DIP SOCKET 36POS TIN

    Aries Electronics

    4,808 2.04
    RFQ
    36-6501-30

    Datasheet

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    40-1518-11H

    40-1518-11H

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    2,719 2.04
    RFQ
    40-1518-11H

    Datasheet

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    HLS-0213-T-30

    HLS-0213-T-30

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,173 -
    RFQ
    HLS-0213-T-30

    Datasheet

    HLS Tube Active SIP 26 (2 x 13) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
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