HONG KONG HAOCHIP TRADING CO., LIMITED

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    48-6508-20

    48-6508-20

    CONN IC DIP SOCKET 48POS GOLD

    Aries Electronics

    2,103 4.98
    RFQ
    48-6508-20

    Datasheet

    508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    48-6508-30

    48-6508-30

    CONN IC DIP SOCKET 48POS GOLD

    Aries Electronics

    4,982 4.98
    RFQ
    48-6508-30

    Datasheet

    508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    34-0508-21

    34-0508-21

    CONN SOCKET SIP 34POS GOLD

    Aries Electronics

    4,619 4.99
    RFQ
    34-0508-21

    Datasheet

    508 Bulk Active SIP 34 (1 x 34) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    34-0508-31

    34-0508-31

    CONN SOCKET SIP 34POS GOLD

    Aries Electronics

    2,950 4.99
    RFQ
    34-0508-31

    Datasheet

    508 Bulk Active SIP 34 (1 x 34) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    34-1508-21

    34-1508-21

    CONN IC DIP SOCKET 34POS GOLD

    Aries Electronics

    2,962 4.99
    RFQ
    34-1508-21

    Datasheet

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    34-1508-31

    34-1508-31

    CONN IC DIP SOCKET 34POS GOLD

    Aries Electronics

    3,746 4.99
    RFQ
    34-1508-31

    Datasheet

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    24-6575-11

    24-6575-11

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    1,507 4.20
    RFQ
    24-6575-11

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    37-0501-21

    37-0501-21

    CONN SOCKET SIP 37POS GOLD

    Aries Electronics

    1,806 4.63
    RFQ
    37-0501-21

    Datasheet

    501 Bulk Active SIP 37 (1 x 37) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    37-0501-31

    37-0501-31

    CONN SOCKET SIP 37POS GOLD

    Aries Electronics

    1,763 4.63
    RFQ
    37-0501-31

    Datasheet

    501 Bulk Active SIP 37 (1 x 37) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    40-81000-610C

    40-81000-610C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    2,398 5.06
    RFQ
    40-81000-610C

    Datasheet

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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