HONG KONG HAOCHIP TRADING CO., LIMITED

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    85-PGM11007-11H

    85-PGM11007-11H

    CONN SOCKET PGA GOLD

    Aries Electronics

    4,321 4.37
    RFQ
    85-PGM11007-11H

    Datasheet

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    192-PGM17025-10

    192-PGM17025-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    2,637 3.98
    RFQ
    192-PGM17025-10

    Datasheet

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    257-PGM20012-10

    257-PGM20012-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    3,409 -
    RFQ
    257-PGM20012-10

    Datasheet

    PGM Bulk Obsolete PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    35-0501-31

    35-0501-31

    CONN SOCKET SIP 35POS GOLD

    Aries Electronics

    3,781 4.38
    RFQ
    35-0501-31

    Datasheet

    501 Bulk Active SIP 35 (1 x 35) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    30-6503-21

    30-6503-21

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    1,308 4.79
    RFQ
    30-6503-21

    Datasheet

    503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    30-6503-31

    30-6503-31

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    3,943 4.79
    RFQ
    30-6503-31

    Datasheet

    503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    28-0511-11

    28-0511-11

    CONN SOCKET SIP 28POS GOLD

    Aries Electronics

    2,397 4.80
    RFQ
    28-0511-11

    Datasheet

    511 Bulk Active SIP 28 (1 x 28) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    32-C182-20

    32-C182-20

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    2,578 4.80
    RFQ
    32-C182-20

    Datasheet

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    32-C182-30

    32-C182-30

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    4,701 4.80
    RFQ
    32-C182-30

    Datasheet

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    32-C212-20

    32-C212-20

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    2,768 4.80
    RFQ
    32-C212-20

    Datasheet

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    Total 4131 Record«Prev1... 319320321322323324325326...414Next»
    Search

    Search

    PRODUCT

    PRODUCT

    PHONE

    PHONE

    USER

    USER