HONG KONG HAOCHIP TRADING CO., LIMITED

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    09-7500-10

    09-7500-10

    CONN SOCKET SIP 9POS TIN

    Aries Electronics

    2,754 2.16
    RFQ
    09-7500-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    09-7510-10

    09-7510-10

    CONN SOCKET SIP 9POS TIN

    Aries Electronics

    4,758 2.16
    RFQ
    09-7510-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    09-7870-10

    09-7870-10

    CONN SOCKET SIP 9POS TIN

    Aries Electronics

    2,529 2.16
    RFQ
    09-7870-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    09-7970-10

    09-7970-10

    CONN SOCKET SIP 9POS TIN

    Aries Electronics

    1,370 2.16
    RFQ
    09-7970-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-6810-90C

    08-6810-90C

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    2,202 1.69
    RFQ
    08-6810-90C

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    32-3513-11

    32-3513-11

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    4,511 2.20
    RFQ
    32-3513-11

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    30-0518-11H

    30-0518-11H

    CONN SOCKET SIP 30POS GOLD

    Aries Electronics

    4,135 1.69
    RFQ
    30-0518-11H

    Datasheet

    518 Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    30-1518-11H

    30-1518-11H

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    1,763 1.69
    RFQ
    30-1518-11H

    Datasheet

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    34-6501-20

    34-6501-20

    CONN IC DIP SOCKET 34POS TIN

    Aries Electronics

    1,994 2.18
    RFQ
    34-6501-20

    Datasheet

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    34-6501-30

    34-6501-30

    CONN IC DIP SOCKET 34POS TIN

    Aries Electronics

    4,367 2.18
    RFQ
    34-6501-30

    Datasheet

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
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