HONG KONG HAOCHIP TRADING CO., LIMITED

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    60-9513-10T

    60-9513-10T

    CONN IC DIP SOCKET 60POS GOLD

    Aries Electronics

    3,576 2.12
    RFQ
    60-9513-10T

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 60 (2 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    48-6513-11

    48-6513-11

    CONN IC DIP SOCKET 48POS GOLD

    Aries Electronics

    1,335 1.66
    RFQ
    48-6513-11

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    12-0508-21

    12-0508-21

    CONN SOCKET SIP 12POS GOLD

    Aries Electronics

    4,552 2.13
    RFQ
    12-0508-21

    Datasheet

    508 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    12-0508-31

    12-0508-31

    CONN SOCKET SIP 12POS GOLD

    Aries Electronics

    3,930 2.13
    RFQ
    12-0508-31

    Datasheet

    508 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    12-1508-21

    12-1508-21

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    4,995 2.13
    RFQ
    12-1508-21

    Datasheet

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    12-1508-31

    12-1508-31

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    4,185 2.13
    RFQ
    12-1508-31

    Datasheet

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    40-6518-11

    40-6518-11

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    3,150 1.58
    RFQ
    40-6518-11

    Datasheet

    518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    20-6513-11H

    20-6513-11H

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    1,976 1.66
    RFQ
    20-6513-11H

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    38-0518-11H

    38-0518-11H

    CONN SOCKET SIP 38POS GOLD

    Aries Electronics

    4,981 2.13
    RFQ
    38-0518-11H

    Datasheet

    518 Bulk Active SIP 38 (1 x 38) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    38-1518-11H

    38-1518-11H

    CONN IC DIP SOCKET 38POS GOLD

    Aries Electronics

    1,978 2.13
    RFQ
    38-1518-11H

    Datasheet

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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