HONG KONG HAOCHIP TRADING CO., LIMITED

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    612-87-432-41-001101

    612-87-432-41-001101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    1,534 0.43
    RFQ
    612-87-432-41-001101

    Datasheet

    612 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-320-STT-L

    ICA-320-STT-L

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,349 -
    RFQ
    ICA-320-STT-L

    Datasheet

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    ICF-624-T-I-TR

    ICF-624-T-I-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,144 -
    RFQ
    ICF-624-T-I-TR

    Datasheet

    ICF Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    22-6513-10

    22-6513-10

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    4,673 0.82
    RFQ
    22-6513-10

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-0518-11

    24-0518-11

    CONN SOCKET SIP 24POS GOLD

    Aries Electronics

    4,934 0.82
    RFQ
    24-0518-11

    Datasheet

    518 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    24-1518-11

    24-1518-11

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    1,652 0.82
    RFQ
    24-1518-11

    Datasheet

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    614-83-624-31-012101

    614-83-624-31-012101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    4,458 0.39
    RFQ
    614-83-624-31-012101

    Datasheet

    614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    14-3513-10H

    14-3513-10H

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    4,337 0.79
    RFQ
    14-3513-10H

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    ICF-316-T-I

    ICF-316-T-I

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,309 -
    RFQ
    ICF-316-T-I

    Datasheet

    ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    116-87-624-41-002101

    116-87-624-41-002101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    2,535 0.49
    RFQ
    116-87-624-41-002101

    Datasheet

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-83-632-41-117101

    114-83-632-41-117101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    1,747 0.40
    RFQ
    114-83-632-41-117101

    Datasheet

    114 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-83-632-41-134161

    114-83-632-41-134161

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    4,131 0.40
    RFQ
    114-83-632-41-134161

    Datasheet

    114 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-640-41-105161

    110-87-640-41-105161

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    2,416 0.50
    RFQ
    110-87-640-41-105161

    Datasheet

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-084-11-002101

    510-87-084-11-002101

    CONN SOCKET PGA 84POS GOLD

    Preci-Dip

    2,688 0.51
    RFQ
    510-87-084-11-002101

    Datasheet

    510 Bulk Active PGA 84 (11 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-084-11-041101

    510-87-084-11-041101

    CONN SOCKET PGA 84POS GOLD

    Preci-Dip

    1,191 0.51
    RFQ
    510-87-084-11-041101

    Datasheet

    510 Bulk Active PGA 84 (11 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-084-11-042101

    510-87-084-11-042101

    CONN SOCKET PGA 84POS GOLD

    Preci-Dip

    4,892 0.51
    RFQ
    510-87-084-11-042101

    Datasheet

    510 Bulk Active PGA 84 (11 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-628-41-012101

    116-87-628-41-012101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,888 0.45
    RFQ
    116-87-628-41-012101

    Datasheet

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-320-41-009101

    116-83-320-41-009101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    3,765 0.43
    RFQ
    116-83-320-41-009101

    Datasheet

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0110-S-2

    HLS-0110-S-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,160 -
    RFQ
    HLS-0110-S-2

    Datasheet

    HLS Tube Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    116-83-422-41-007101

    116-83-422-41-007101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    2,505 0.46
    RFQ
    116-83-422-41-007101

    Datasheet

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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