HONG KONG HAOCHIP TRADING CO., LIMITED

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    115-83-636-41-001101

    115-83-636-41-001101

    CONN IC DIP SOCKET 36POS GOLD

    Preci-Dip

    2,784 0.48
    RFQ

    -

    115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-428-41-007101

    116-87-428-41-007101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    4,382 0.49
    RFQ
    116-87-428-41-007101

    Datasheet

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    828-AG12D-ES-LF

    828-AG12D-ES-LF

    CONN IC DIP SOCKET 28POS TIN

    TE Connectivity AMP Connectors

    4,560 0.87
    RFQ
    828-AG12D-ES-LF

    Datasheet

    800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole, Right Angle, Vertical Open Frame Solder 0.100" (2.54mm) Tin - Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
    117-83-624-41-105101

    117-83-624-41-105101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    4,652 0.41
    RFQ
    117-83-624-41-105101

    Datasheet

    117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    643650-6

    643650-6

    CONN SOCKET SIP 18POS TIN

    TE Connectivity AMP Connectors

    4,580 -
    RFQ
    643650-6

    Datasheet

    Diplomate DL Tray Obsolete SIP 18 (1 x 18) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 105°C
    ICO-308-ZSGT

    ICO-308-ZSGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,945 -
    RFQ
    ICO-308-ZSGT

    Datasheet

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICO-320-STT

    ICO-320-STT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,987 -
    RFQ
    ICO-320-STT

    Datasheet

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    510-87-081-12-071101

    510-87-081-12-071101

    CONN SOCKET PGA 81POS GOLD

    Preci-Dip

    4,100 0.49
    RFQ
    510-87-081-12-071101

    Datasheet

    510 Bulk Active PGA 81 (12 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-636-41-018101

    116-87-636-41-018101

    CONN IC DIP SOCKET 36POS GOLD

    Preci-Dip

    4,540 0.48
    RFQ
    116-87-636-41-018101

    Datasheet

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    20-6513-10

    20-6513-10

    IC SOCK COLLET CT 20 PIN GOLD

    Aries Electronics

    1,398 0.80
    RFQ

    -

    513 - Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-87-312-41-013101

    116-87-312-41-013101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    4,371 0.50
    RFQ
    116-87-312-41-013101

    Datasheet

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICF-320-TL-I-TR

    ICF-320-TL-I-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,664 -
    RFQ
    ICF-320-TL-I-TR

    Datasheet

    ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    110-83-328-41-105161

    110-83-328-41-105161

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    1,207 0.42
    RFQ
    110-83-328-41-105161

    Datasheet

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-624-41-009101

    116-87-624-41-009101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    3,044 0.48
    RFQ
    116-87-624-41-009101

    Datasheet

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    121-83-422-41-001101

    121-83-422-41-001101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    2,597 0.44
    RFQ
    121-83-422-41-001101

    Datasheet

    121 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-318-ZSTT

    ICA-318-ZSTT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,854 -
    RFQ
    ICA-318-ZSTT

    Datasheet

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    115-87-650-41-003101

    115-87-650-41-003101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    1,482 0.48
    RFQ
    115-87-650-41-003101

    Datasheet

    115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    212-1-20-003

    212-1-20-003

    CONN IC DIP SOCKET 20POS GOLD

    CNC Tech

    1,847 -
    RFQ
    212-1-20-003

    Datasheet

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -40°C ~ 105°C
    116-83-318-41-001101

    116-83-318-41-001101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    3,790 0.42
    RFQ
    116-83-318-41-001101

    Datasheet

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-049-07-000101

    510-83-049-07-000101

    CONN SOCKET PGA 49POS GOLD

    Preci-Dip

    4,407 0.43
    RFQ
    510-83-049-07-000101

    Datasheet

    510 Bulk Active PGA 49 (7 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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