HONG KONG HAOCHIP TRADING CO., LIMITED

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    116-83-610-41-004101

    116-83-610-41-004101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    2,993 0.38
    RFQ
    116-83-610-41-004101

    Datasheet

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-316-41-009101

    116-83-316-41-009101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    4,955 0.35
    RFQ
    116-83-316-41-009101

    Datasheet

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-328-41-018101

    116-87-328-41-018101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    2,797 0.32
    RFQ
    116-87-328-41-018101

    Datasheet

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    123-87-424-41-001101

    123-87-424-41-001101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    2,120 0.40
    RFQ
    123-87-424-41-001101

    Datasheet

    123 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    516-AG11D-ESL

    516-AG11D-ESL

    CONN IC DIP SOCKET 16POS GOLD

    TE Connectivity AMP Connectors

    1,209 -
    RFQ
    516-AG11D-ESL

    Datasheet

    500 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 5.00µin (0.127µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 5.00µin (0.127µm) Beryllium Copper Polyester -55°C ~ 125°C
    ICO-308-SST-L

    ICO-308-SST-L

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,686 -
    RFQ
    ICO-308-SST-L

    Datasheet

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
    ICA-308-ZWTT

    ICA-308-ZWTT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,803 -
    RFQ
    ICA-308-ZWTT

    Datasheet

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    110-87-632-41-105161

    110-87-632-41-105161

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    2,957 0.37
    RFQ
    110-87-632-41-105161

    Datasheet

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    540-44-052-24-000000

    540-44-052-24-000000

    CONN SOCKET PLCC 52POS TIN

    Mill-Max Manufacturing Corp.

    3,377 -
    RFQ
    540-44-052-24-000000

    Datasheet

    540 Tube Obsolete PLCC 52 (4 x 13) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 150.0µin (3.81µm) Copper Alloy Polyphenylene Sulfide (PPS) -55°C ~ 125°C
    C8118-04

    C8118-04

    CONN IC DIP SOCKET 18POS TIN

    Aries Electronics

    3,014 -
    RFQ
    C8118-04

    Datasheet

    Edge-Grip™, C81 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    15-0513-11

    15-0513-11

    CONN SOCKET SIP 15POS GOLD

    Aries Electronics

    3,940 0.66
    RFQ
    15-0513-11

    Datasheet

    0513 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    14-0518-00

    14-0518-00

    CONN SOCKET SIP 14POS GOLD

    Aries Electronics

    1,658 0.66
    RFQ
    14-0518-00

    Datasheet

    518 Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    714-43-105-31-018000

    714-43-105-31-018000

    CONN SOCKET SIP 5POS GOLD

    Mill-Max Manufacturing Corp.

    3,470 0.32
    RFQ
    714-43-105-31-018000

    Datasheet

    714 Tube Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-87-210-41-013101

    116-87-210-41-013101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    3,375 0.35
    RFQ
    116-87-210-41-013101

    Datasheet

    116 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICF-320-T-I-TR

    ICF-320-T-I-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    1,467 -
    RFQ
    ICF-320-T-I-TR

    Datasheet

    ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    D95014-42

    D95014-42

    CONN IC DIP SOCKET 14POS GOLD

    Harwin Inc.

    4,211 0.36
    RFQ
    D95014-42

    Datasheet

    D95 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0106-T-15

    HLS-0106-T-15

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,653 -
    RFQ
    HLS-0106-T-15

    Datasheet

    HLS Tube Active SIP 6 (1 x 6) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    612-83-322-41-001101

    612-83-322-41-001101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    4,634 0.31
    RFQ
    612-83-322-41-001101

    Datasheet

    612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    122-87-322-41-001101

    122-87-322-41-001101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    3,211 0.33
    RFQ
    122-87-322-41-001101

    Datasheet

    122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-43-424-41-001000

    110-43-424-41-001000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    1,155 0.35
    RFQ
    110-43-424-41-001000

    Datasheet

    110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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