HONG KONG HAOCHIP TRADING CO., LIMITED

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    214-44-624-01-670800

    214-44-624-01-670800

    CONN IC DIP SOCKET 24POS TIN

    Mill-Max Manufacturing Corp.

    2,573 0.36
    RFQ
    214-44-624-01-670800

    Datasheet

    214 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    146-87-420-41-035101

    146-87-420-41-035101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    4,215 0.32
    RFQ
    146-87-420-41-035101

    Datasheet

    146 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-87-420-41-036101

    146-87-420-41-036101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    4,356 0.32
    RFQ
    146-87-420-41-036101

    Datasheet

    146 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-314-ZSTT

    ICO-314-ZSTT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,136 -
    RFQ
    ICO-314-ZSTT

    Datasheet

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    110-83-324-41-105101

    110-83-324-41-105101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    2,613 0.33
    RFQ
    110-83-324-41-105101

    Datasheet

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    SA649040

    SA649040

    CONN IC DIP SOCKET 64POS GOLD

    On Shore Technology Inc.

    3,656 -
    RFQ
    SA649040

    Datasheet

    SA Tube Obsolete DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 80.0µin (2.03µm) Brass Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
    2-1571551-8

    2-1571551-8

    CONN IC DIP SOCKET 24POS GOLD

    TE Connectivity AMP Connectors

    1,444 -
    RFQ
    2-1571551-8

    Datasheet

    500 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold Flash Nickel Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-87-068-09-001101

    510-87-068-09-001101

    CONN SOCKET PGA 68POS GOLD

    Preci-Dip

    3,251 0.35
    RFQ
    510-87-068-09-001101

    Datasheet

    510 Bulk Active PGA 68 (9 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-322-41-018101

    116-83-322-41-018101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    2,922 0.33
    RFQ
    116-83-322-41-018101

    Datasheet

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    612-87-632-41-001101

    612-87-632-41-001101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    3,857 0.39
    RFQ
    612-87-632-41-001101

    Datasheet

    612 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0104-G-12

    HLS-0104-G-12

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    1,522 -
    RFQ
    HLS-0104-G-12

    Datasheet

    HLS Tube Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    ICF-308-TL-I

    ICF-308-TL-I

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,037 -
    RFQ
    ICF-308-TL-I

    Datasheet

    ICF Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    116-87-628-41-003101

    116-87-628-41-003101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    1,621 0.40
    RFQ
    116-87-628-41-003101

    Datasheet

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-624-41-105101

    110-83-624-41-105101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    1,993 0.34
    RFQ
    110-83-624-41-105101

    Datasheet

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    06-2513-11H

    06-2513-11H

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    4,103 0.66
    RFQ
    06-2513-11H

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-0513-10H

    14-0513-10H

    CONN SOCKET SIP 14POS GOLD

    Aries Electronics

    1,537 0.66
    RFQ
    14-0513-10H

    Datasheet

    0513 Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    11-0518-11H

    11-0518-11H

    CONN SOCKET SIP 11POS GOLD

    Aries Electronics

    2,377 0.66
    RFQ
    11-0518-11H

    Datasheet

    518 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    19-0518-11

    19-0518-11

    CONN SOCKET SIP 19POS GOLD

    Aries Electronics

    2,272 0.66
    RFQ
    19-0518-11

    Datasheet

    518 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    HLS-0106-T-31

    HLS-0106-T-31

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,230 -
    RFQ
    HLS-0106-T-31

    Datasheet

    HLS Tube Active SIP 6 (1 x 6) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    28-3518-10T

    28-3518-10T

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,337 0.53
    RFQ
    28-3518-10T

    Datasheet

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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