HONG KONG HAOCHIP TRADING CO., LIMITED

    Microcontrollers, Microprocessor, FPGA Modules

    制造商 Series Packaging Product Status Module/Board Type Core Processor Co-Processor Speed Flash Size RAM Size Connector Type Size / Dimension Operating Temperature





































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Module/Board Type Core Processor Co-Processor Speed Flash Size RAM Size Connector Type Size / Dimension Operating Temperature
    TE0745-03-93E31-AK

    TE0745-03-93E31-AK

    SOM WITH AMD ZYNQ 7045-3E AND HE

    Trenz Electronic GmbH

    2,929 -
    RFQ

    -

    Zynq Bulk Active MPU Core ARM Cortex-A9 Xilinx Zynq 7045 SoC XC7Z045-3FFG676E - 64MB 1GB Samtec ST5 2.990" L x 2.050" W (76.00mm x 52.00mm) -40°C ~ 85°C
    TE0783-02-92I33MA

    TE0783-02-92I33MA

    HIGH-PERFORMANCE SOM WITH XILINX

    Trenz Electronic GmbH

    3,537 -
    RFQ

    -

    TE0782 Bulk Active MPU Core Zynq™ 7000 XC7Z045-2FFG900I ARM Cortex-A9 - 32MB 1GB Board-to-Board (BTB) Socket 3.350" L x 3.350" W (85.00mm x 85.00mm) -40°C ~ 85°C
    TE0782-02-92I33MA

    TE0782-02-92I33MA

    IC MODULE CORTEX

    Trenz Electronic GmbH

    3,900 -
    RFQ
    TE0782-02-92I33MA

    Datasheet

    TE0782 Bulk Active MCU, FPGA ARM Cortex-A9 Zynq-7000 (Z-7045) - 32MB 1GB Board-to-Board (BTB) Socket 3.350" L x 3.350" W (85.00mm x 85.00mm) -40°C ~ 85°C
    TE0807-03-7AI21-A

    TE0807-03-7AI21-A

    MPSOC ZYNQ USCALE 4GB DDR4

    Trenz Electronic GmbH

    3,887 456.52
    RFQ
    TE0807-03-7AI21-A

    Datasheet

    TE0807 Box Discontinued at Digi-Key MPU Core Zynq UltraScale+ XCZU7CG-1FBVB900I - - 128MB 4GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) -40°C ~ 85°C
    TE0817-01-7DI21-A

    TE0817-01-7DI21-A

    MPSOC MODULE WITH XILINX ZYNQ UL

    Trenz Electronic GmbH

    2,736 -
    RFQ

    -

    Zynq® UltraScale+™ Bulk Obsolete MPU Core Zynq UltraScale+ XCZU7EV-1FBVB900I - - 128MB 4GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) -40°C ~ 85°C
    TE0807-03-7DI21-AZ

    TE0807-03-7DI21-AZ

    MPSOC MODULE WITH AMD ZYNQ ULTRA

    Trenz Electronic GmbH

    1,021 -
    RFQ

    -

    Zynq UltraScale+ Bulk Obsolete MPU Core Xilinx Zynq UltraScale+ XCZU7EV-1FBVB900I - - 128MB 4GB Board-to-Board (BTB) Socket - 4 x 160 2.990" L x 2.050" W (76.00mm x 52.00mm) -40°C ~ 85°C
    TEC0850-03-BBEX1-A

    TEC0850-03-BBEX1-A

    IC MODULE

    Trenz Electronic GmbH

    2,351 -
    RFQ

    -

    * Bulk Active - - - - - - - - -
    TE0865-02-ABI21MA

    TE0865-02-ABI21MA

    MPSOC MODULE WITH ZYNQ ULTRASCAL

    Trenz Electronic GmbH

    2,447 -
    RFQ

    -

    Zynq® UltraScale+™ Bulk Active MPU Core Zynq™ UltraScale+™ XCZU11EG-1FFVC1760I - - 256MB 4GB Board-to-Board (BTB) Socket 3.937" L x 2.953" W (100.00mm x 75.00mm) 0°C ~ 85°C
    TE0865-02-FBE23MA

    TE0865-02-FBE23MA

    MPSOC MODULE WITH ZYNQ ULTRASCAL

    Trenz Electronic GmbH

    4,582 -
    RFQ

    -

    Zynq® UltraScale+™ Bulk Active MPU Core Zynq™ UltraScale+™ XCZU19EG-1FFVC1760E - - 256MB 4GB Board-to-Board (BTB) Socket 3.937" L x 2.953" W (100.00mm x 75.00mm) 0°C ~ 85°C
    TE0865-02-DGE23MA

    TE0865-02-DGE23MA

    MPSOC MODULE WITH ZYNQ ULTRASCAL

    Trenz Electronic GmbH

    4,028 -
    RFQ

    -

    Zynq® UltraScale+™ Bulk Active MPU Core Zynq™ UltraScale+™ XCZU17EG-2FFVC1760E - - 256MB 4GB Board-to-Board (BTB) Socket 3.937" L x 2.953" W (100.00mm x 75.00mm) 0°C ~ 85°C
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