HONG KONG HAOCHIP TRADING CO., LIMITED

    Microcontrollers, Microprocessor, FPGA Modules

    制造商 Series Packaging Product Status Module/Board Type Core Processor Co-Processor Speed Flash Size RAM Size Connector Type Size / Dimension Operating Temperature





































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Module/Board Type Core Processor Co-Processor Speed Flash Size RAM Size Connector Type Size / Dimension Operating Temperature
    TE0817-01-7DE21-A

    TE0817-01-7DE21-A

    MPSOC MODULE WITH XILINX ZYNQ UL

    Trenz Electronic GmbH

    1,011 -
    RFQ

    -

    Zynq® UltraScale+™ Bulk Obsolete MPU Core Zynq UltraScale+ XCZU7EV-1FBVB900E - - 128MB 4GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
    TE0782-02-82I33MA

    TE0782-02-82I33MA

    IC MODULE CORTEX

    Trenz Electronic GmbH

    1,003 -
    RFQ
    TE0782-02-82I33MA

    Datasheet

    TE0782 Bulk Active MCU, FPGA ARM Cortex-A9 Zynq-7000 (Z-7035) - 32MB 1GB Board-to-Board (BTB) Socket 3.350" L x 3.350" W (85.00mm x 85.00mm) -40°C ~ 85°C
    TE0807-03-7DE21-A

    TE0807-03-7DE21-A

    MPSOC MODULE WITH XILINX ZYNQ UL

    Trenz Electronic GmbH

    4,922 -
    RFQ
    TE0807-03-7DE21-A

    Datasheet

    TE0807 Bulk Discontinued at Digi-Key MPU Core Zynq UltraScale+ XCZU7EV-1FBVB900E - - 128MB 4GB 4 x 160 Pin 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
    TE0745-02-92I31-F

    TE0745-02-92I31-F

    MOD SOM DDR3L 1GB

    Trenz Electronic GmbH

    4,651 450.90
    RFQ
    TE0745-02-92I31-F

    Datasheet

    TE0745 Bulk Active MCU, FPGA ARM Cortex-A9 Zynq-7000 (Z-7045) - 64MB 1GB Board-to-Board (BTB) Socket - 480 2.050" L x 2.990" W (52.00mm x 76.00mm) -40°C ~ 85°C
    TE0807-03-7DE21-AK

    TE0807-03-7DE21-AK

    MPSOC MODULE TE0807 WITH ZYNQ UL

    Trenz Electronic GmbH

    3,489 -
    RFQ
    TE0807-03-7DE21-AK

    Datasheet

    TE0807 Bulk Discontinued at Digi-Key MPU Core Zynq UltraScale+ XCZU7EV-1FBVB900E - - 128MB 4GB Board-to-Board (BTB) Socket - 160 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
    TE0745-02-93E31-A

    TE0745-02-93E31-A

    MOD SOM DDR3L 1GB

    Trenz Electronic GmbH

    3,380 489.15
    RFQ
    TE0745-02-93E31-A

    Datasheet

    TE0745 Bulk Active MCU, FPGA ARM Cortex-A9 Zynq-7000 (Z-7045) - 64MB 1GB Board-to-Board (BTB) Socket - 480 2.050" L x 2.990" W (52.00mm x 76.00mm) -40°C ~ 85°C
    TE0808-05-BBE21-AZ

    TE0808-05-BBE21-AZ

    MODULE MPSOC 2GB DDR4

    Trenz Electronic GmbH

    2,396 -
    RFQ
    TE0808-05-BBE21-AZ

    Datasheet

    - Box Discontinued at Digi-Key FPGA Core Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E - - 128MB 2GB Board-to-Board (BTB) Socket 2.050" L x 2.990" W (52.00mm x 76.00mm) 0°C ~ 85°C
    TE0817-01-7AI21-A

    TE0817-01-7AI21-A

    MPSOC MODULE WITH XILINX ZYNQ UL

    Trenz Electronic GmbH

    4,853 -
    RFQ

    -

    Zynq® UltraScale+™ Bulk Obsolete MPU Core Zynq UltraScale+ XCZU7CG-1FBVB900I - - 128MB 4GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) -40°C ~ 85°C
    TE0745-03-93E31-A

    TE0745-03-93E31-A

    SOM WITH AMD ZYNQ 7045-3E, 1 GBY

    Trenz Electronic GmbH

    2,084 -
    RFQ

    -

    Zynq Bulk Active MPU Core ARM Cortex-A9 Xilinx Zynq 7045 SoC XC7Z045-3FFG676E - 64MB 1GB Samtec ST5 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
    TE0745-02-93E31-AK

    TE0745-02-93E31-AK

    SOM WITH XILINX ZYNQ 7045-3E AND

    Trenz Electronic GmbH

    2,036 -
    RFQ

    -

    TE0745 Bulk Active MPU Core Zynq™ 7045 SoC XC7Z045-3FFG676E ARM Cortex-A9 - 64MB 1GB Board-to-Board (BTB) Socket 2.990" L x 2.050" W (76.00mm x 52.00mm) -40°C ~ 85°C
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