HONG KONG HAOCHIP TRADING CO., LIMITED

    Heat Sinks

    制造商 Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material 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    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material Finish
    335224B00032G

    335224B00032G

    335224B00032G

    Boyd Laconia, LLC

    1,898 -
    RFQ

    -

    - Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Pin Fins 0.984" (25.00mm) 0.985" (25.00mm) - 0.390" (9.91mm) 1.5W @ 50°C 10.40°C/W @ 200 LFM 34.00°C/W Aluminum Black Anodized
    342948-COPPER SKIVFIN

    342948-COPPER SKIVFIN

    342948,REV03(GP)

    Boyd Laconia, LLC

    2,193 -
    RFQ

    -

    - Bulk Active Board Level BGA, FPGA Push Pin, Thermal Material Rectangular, Fins 2.717" (69.00mm) 2.756" (70.00mm) - 0.551" (14.00mm) - - - Copper -
    2321B-TACHG

    2321B-TACHG

    THM,2321B-TACHG

    Boyd Laconia, LLC

    4,270 -
    RFQ

    -

    - Bulk Active Top Mount BGA Bolt On Rectangular, Pin Fins 1.701" (43.20mm) 1.626" (41.30mm) - 0.350" (8.89mm) - 6.93°C/W @ 200 LFM 22.10°C/W Aluminum Black Anodized
    7021B-8223-CL03G

    7021B-8223-CL03G

    THM,7021B-8223-CL03G

    Boyd Laconia, LLC

    1,774 -
    RFQ

    -

    - Bulk Active Board Level, Vertical TO-218, TO-220 Bolt On and PC Pin Rectangular, Fins 1.750" (44.45mm) 0.360" (9.14mm) - 1.450" (36.83mm) 6.0W @ 50°C 4.00°C/W @ 300 LFM 6.80°C/W Aluminum Black Anodized
    10-BRD1-03G

    10-BRD1-03G

    10-BRD1-03G

    Boyd Laconia, LLC

    3,061 -
    RFQ

    -

    - Bulk Active Top Mount BGA Solder Anchor Square, Pin Fins 1.476" (37.50mm) 1.476" (37.50mm) - 0.905" (23.00mm) - 3.83°C/W @ 200 LFM 10.10°C/W Aluminum Black Anodized
    374524B00023G

    374524B00023G

    306219 WITHOUT PAD,REV 00,00,04

    Boyd Laconia, LLC

    4,983 -
    RFQ

    -

    - Bulk Active Top Mount BGA, FPGA Thermal Tape, Adhesive (Included) Square, Pin Fins 1.063" (27.00mm) 1.063" (27.00mm) - 0.984" (25.00mm) 1.0W @ 20°C 5.00°C/W @ 250 LFM - Aluminum Black Anodized
    EH-160-H245G

    EH-160-H245G

    EH-160-H245, FG(GP)

    Boyd Laconia, LLC

    2,733 -
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - -
    KU-SBK-0381-ES-ST-0,3MM-SG

    KU-SBK-0381-ES-ST-0,3MM-SG

    KU-SBK-0381-ES-ST-0,3MM-SG

    Boyd Laconia, LLC

    1,716 -
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - -
    KU-0334-AL-ST-1,2MM-3-A-VE/VZ-

    KU-0334-AL-ST-1,2MM-3-A-VE/VZ-

    KU-0334-AL-ST-1,2MM-3-A-VE/VZ-

    Boyd Laconia, LLC

    3,383 -
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - -
    11-5602-45G

    11-5602-45G

    11-5602-45G

    Boyd Laconia, LLC

    2,765 -
    RFQ

    -

    - Bulk Active Top Mount BGA Push Pin Square, Pin Fins 1.575" (40.00mm) 1.575" (40.00mm) - 0.413" (10.50mm) - - 3.40°C/W Aluminum Black Anodized
    372024B00032G

    372024B00032G

    372024B00032G

    Boyd Laconia, LLC

    2,676 -
    RFQ

    -

    - Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.378" (35.00mm) 1.378" (35.00mm) - 1.098" (27.90mm) 3.0W @ 40°C 5.00°C/W @ 150 LFM 11.90°C/W Aluminum Black Anodized
    572802B04000G

    572802B04000G

    572802B04000G

    Boyd Laconia, LLC

    4,088 -
    RFQ

    -

    - Bulk Active Board Level, Vertical TO-220 Clip and PC Pin Rectangular, Fins 0.500" (12.70mm) 0.750" (19.05mm) - 0.570" (14.48mm) 1.0W @ 30°C 7.00°C/W @ 400 LFM - Aluminum Black Anodized
    579103V00000G

    579103V00000G

    STD,579103V00000G

    Boyd Laconia, LLC

    3,411 -
    RFQ

    -

    - Bulk Active Top Mount TO-3 Bolt On Rectangular 1.125" (28.58mm) 1.540" (39.12mm) - 0.870" (22.10mm) 1.5W @ 30°C 6.00°C/W @ 300 LFM - Aluminum Black Anodized
    520327B00000G

    520327B00000G

    STD,520327B00000G

    Boyd Laconia, LLC

    3,790 -
    RFQ

    -

    - Bulk Active Board Level TO-3 Bolt On Rectangular 1.534" (38.96mm) 1.250" (31.75mm) - 0.500" (12.70mm) 3W @ 40°C 3.00°C/W @ 600 LFM 4.70°C/W Aluminum Black Anodized
    780301F00000G

    780301F00000G

    EXTR,78030-8.2FT(98.4")

    Boyd Laconia, LLC

    3,719 -
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - -
    533721B02552G

    533721B02552G

    STD,533721B02552G

    Boyd Laconia, LLC

    2,227 -
    RFQ

    -

    - Bulk Active Board Level, Extrusion TO-218, TO-220, TO-247 2 Clips and PC Pin Rectangular, Fins 1.650" (41.91mm) 1.000" (25.40mm) - 1.000" (25.40mm) 4.0W @ 30°C 2.50°C/W @ 500 LFM 5.70°C/W Aluminum Black Anodized
    B60-075-AE

    B60-075-AE

    HEATSINK FOR TO-247 TO-264

    Ohmite

    2,978 9.15
    RFQ
    B60-075-AE

    Datasheet

    B60 Case Active Board Level, Vertical TO-220, TO-247, TO-264 Clip, Solder Foot Rectangular, Fins 2.950" (74.93mm) 2.530" (64.26mm) - 1.610" (40.89mm) - - - Aluminum Alloy Black Anodized
    KK0729-03

    KK0729-03

    HEATSPREADER FOR TE0729-02

    Trenz Electronic GmbH

    3,207 -
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - -
    KK0835-03

    KK0835-03

    HEAT SPREADER WITH FAN FOR TRENZ

    Trenz Electronic GmbH

    2,103 -
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - -
    MBF37.5006-13P/CU/2.6

    MBF37.5006-13P/CU/2.6

    AL HEAT SINK 37X37X13MM WITH 12V

    Malico Inc.

    3,896 -
    RFQ
    MBF37.5006-13P/CU/2.6

    Datasheet

    * Active - - - - - - - - - - - - -
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