HONG KONG HAOCHIP TRADING CO., LIMITED

    Heat Sinks

    制造商 Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material 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    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material Finish
    ATS-LQHS-74025-C1-R0

    ATS-LQHS-74025-C1-R0

    LIQUID ASSISTED FANSINK ASMBLY,

    Advanced Thermal Solutions Inc.

    2,675 -
    RFQ
    ATS-LQHS-74025-C1-R0

    Datasheet

    fanSINK™ Box Active Top Mount BGA Push Pin, Thermal Material Square, Pin Fins 2.913" (74.00mm) 2.913" (74.00mm) - 1.016" (25.80mm) - - 0.13°C/W - Black Anodized
    ATS-LQHS-84030-C1-R0

    ATS-LQHS-84030-C1-R0

    LIQUID ASSISTED FANSINK ASMBLY,

    Advanced Thermal Solutions Inc.

    2,035 -
    RFQ
    ATS-LQHS-84030-C1-R0

    Datasheet

    fanSINK™ Box Active Top Mount BGA Push Pin, Thermal Material Square, Pin Fins 3.307" (84.00mm) 3.307" (84.00mm) - 1.213" (30.80mm) - - - - Black Anodized
    ATS-LQHS-84025-C1-R0

    ATS-LQHS-84025-C1-R0

    LIQUID ASSISTED FANSINK ASMBLY,

    Advanced Thermal Solutions Inc.

    1,763 -
    RFQ
    ATS-LQHS-84025-C1-R0

    Datasheet

    fanSINK™ Box Active Top Mount BGA Push Pin, Thermal Material Square, Pin Fins 3.307" (84.00mm) 3.307" (84.00mm) - 1.016" (25.80mm) - - - - Black Anodized
    ATS-UC-CRYQL-100

    ATS-UC-CRYQL-100

    ULTRA COOL HEAT SINK CRYOQOOL, C

    Advanced Thermal Solutions Inc.

    1,015 -
    RFQ
    ATS-UC-CRYQL-100

    Datasheet

    - Box Active Top Mount Intel LGA2011 & LGA2066 & LGA1366 CPU Cooler Push Pin, Thermal Material Rectangular, Fins 5.394" (137.00mm) 3.843" (97.60mm) - 1.882" (47.80mm) - - - Copper -
    ATS-UC-ARGUS-D200

    ATS-UC-ARGUS-D200

    ULTRA COOL DUALFLOW HEAT SINK, A

    Advanced Thermal Solutions Inc.

    3,680 -
    RFQ
    ATS-UC-ARGUS-D200

    Datasheet

    - Box Active Top Mount Intel LGA2011 & LGA2066 CPU Cooler Push Pin, Thermal Material Square, Fins 4.764" (121.00mm) 4.764" (121.00mm) - 2.520" (64.00mm) - - - Copper Nickel
    SAR-TR10

    SAR-TR10

    TRANSISTOR HEATSINK TO-220

    Sarnikon

    440 0.08
    RFQ
    SAR-TR10

    Datasheet

    - Bulk Active Board Level - PC Pin Rectangular, Fins 1.122" (28.50mm) 1.181" (30.00mm) - 0.945" (24.00mm) - - - Aluminum Black Anodized
    833202B03700

    833202B03700

    HEATSINK STAMP 10X21.2X19MM

    Comair Rotron

    347 0.09
    RFQ
    833202B03700

    Datasheet

    - Bulk Obsolete Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 0.750" (19.05mm) 0.835" (21.21mm) - 0.394" (10.00mm) 3.0W @ 60°C 12.00°C/W @ 200 LFM - Aluminum Black Anodized
    HSE-B18254-035H-00

    HSE-B18254-035H-00

    HEAT SINK, EXTRUSION, TO-218, 25

    Same Sky (Formerly CUI Devices)

    2,522 0.08
    RFQ
    HSE-B18254-035H-00

    Datasheet

    HSE Bulk Active Board Level, Vertical TO-218 Clip and PC Pin Rectangular, Angled Fins 1.000" (25.40mm) 1.638" (41.60mm) - 0.984" (25.00mm) 10.0W @ 75°C 4.03°C/W @ 200 LFM 7.50°C/W Aluminum Alloy Black Anodized
    833202B04800

    833202B04800

    HEATSINK STAMP 10X21.2X19MM

    Comair Rotron

    933 0.09
    RFQ
    833202B04800

    Datasheet

    - Bulk Obsolete Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 0.750" (19.05mm) 0.835" (21.21mm) - 0.394" (10.00mm) 3.0W @ 60°C 12.00°C/W @ 200 LFM - Aluminum Black Anodized
    XL25-20-20-2.0

    XL25-20-20-2.0

    XL25 CERAMIC BOARD 20X20X2MM

    t-Global Technology

    345 0.12
    RFQ
    XL25-20-20-2.0

    Datasheet

    XL-25 Box Obsolete Heat Spreader Assorted (BGA, LGA, CPU, ASIC...) - Square 0.787" (20.00mm) 0.787" (20.00mm) - 0.079" (2.00mm) - - - Ceramic -
    SAR57ASX30MM

    SAR57ASX30MM

    EXTRUDED HEATSINK 57MM X 30MM

    Sarnikon

    495 0.14
    RFQ
    SAR57ASX30MM

    Datasheet

    57AS Box Active Board Level TO-220 PC Pin Rectangular, Fins 1.181" (30.00mm) 0.602" (15.30mm) - 0.472" (12.00mm) - - - Aluminum Black Anodized
    XL25-35-35-10

    XL25-35-35-10

    CERAMIC HEAT SPREADER 35X35MM GR

    t-Global Technology

    2,501 0.14
    RFQ
    XL25-35-35-10

    Datasheet

    XL-25 Tray Obsolete Heat Spreader Assorted (BGA, LGA, CPU, ASIC...) - Square 1.378" (35.00mm) 1.378" (35.00mm) - 0.394" (10.00mm) - - - Ceramic -
    SAR59ASX30MM

    SAR59ASX30MM

    EXTRUDED HEATSINK 59MM X 30MM

    Sarnikon

    394 0.15
    RFQ
    SAR59ASX30MM

    Datasheet

    59AS Box Active Board Level TO-220 PC Pin Rectangular, Fins 1.181" (30.00mm) 0.933" (23.70mm) - 0.650" (16.51mm) - - - Aluminum Black Anodized
    SAR59ASX35MM

    SAR59ASX35MM

    EXTRUDED HEATSINK 59MM X 35MM

    Sarnikon

    500 0.16
    RFQ
    SAR59ASX35MM

    Datasheet

    59AS Box Active Board Level TO-220 PC Pin Rectangular, Fins 1.378" (35.00mm) 0.933" (23.70mm) - 0.650" (16.51mm) - - - Aluminum Black Anodized
    XL25-40-40-10

    XL25-40-40-10

    CERAMIC HEAT SPREADER 40X40MM GR

    t-Global Technology

    3,841 0.17
    RFQ
    XL25-40-40-10

    Datasheet

    XL-25 Tray Obsolete Heat Spreader Assorted (BGA, LGA, CPU, ASIC...) - Square 1.575" (40.00mm) 1.575" (40.00mm) - 0.394" (10.00mm) - - - Ceramic -
    XL25-40-40-10-T1-0.25

    XL25-40-40-10-T1-0.25

    CERAMIC HEAT SPREADER 40X40MM GR

    t-Global Technology

    4,404 0.22
    RFQ
    XL25-40-40-10-T1-0.25

    Datasheet

    XL-25 Tray Obsolete Heat Spreader Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square 1.575" (40.00mm) 1.575" (40.00mm) - 0.394" (10.00mm) - - - Ceramic -
    XL25-40-40-3.0

    XL25-40-40-3.0

    XL25 CERAMIC BOARD 40X40X3MM

    t-Global Technology

    3,575 0.24
    RFQ
    XL25-40-40-3.0

    Datasheet

    XL-25 Box Obsolete Heat Spreader Assorted (BGA, LGA, CPU, ASIC...) - Square 1.575" (40.00mm) 1.575" (40.00mm) - 0.118" (3.00mm) - - - Ceramic -
    XL25-50-50-10

    XL25-50-50-10

    CERAMIC HEAT SPREADER 50X50MM GR

    t-Global Technology

    4,306 0.26
    RFQ
    XL25-50-50-10

    Datasheet

    XL-25 Tray Obsolete Heat Spreader Assorted (BGA, LGA, CPU, ASIC...) - Square 1.969" (50.00mm) 1.969" (50.00mm) - 0.394" (10.00mm) - - - Ceramic -
    695-1B

    695-1B

    HEATSINK FOR STUD MT DIODE BLACK

    Wakefield-Vette

    3,119 0.26
    RFQ
    695-1B

    Datasheet

    695 Bulk Obsolete Board Level Stud Mounted Diode Bolt On - - - 0.625" (15.88mm) ID, 1.330" (33.78mm) OD 0.530" (13.46mm) 4.0W @ 72°C 5.20°C/W @ 400 LFM 18.00°C/W Aluminum Black Anodized
    XL25-50-50-10-T1-0.25

    XL25-50-50-10-T1-0.25

    CERAMIC HEAT SPREADER 50X50MM GR

    t-Global Technology

    2,873 0.33
    RFQ
    XL25-50-50-10-T1-0.25

    Datasheet

    XL-25 Tray Obsolete Heat Spreader Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square 1.969" (50.00mm) 1.969" (50.00mm) - 0.394" (10.00mm) - - - Ceramic -
    Total 122183 Record«Prev1... 538539540541542543544545...6110Next»
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