HONG KONG HAOCHIP TRADING CO., LIMITED

    Heat Sinks

    制造商 Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material 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    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material Finish
    533566B42552G

    533566B42552G

    533566B42552G

    Boyd Laconia, LLC

    1,200 -
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - -
    581102B00000W/2 041476 PINSG

    581102B00000W/2 041476 PINSG

    581102B00000W/2 041476 PINSG

    Boyd Laconia, LLC

    2,099 -
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - -
    335224B00032G

    335224B00032G

    335224B00032G

    Boyd Laconia, LLC

    1,898 -
    RFQ

    -

    - Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Pin Fins 0.984" (25.00mm) 0.985" (25.00mm) - 0.390" (9.91mm) 1.5W @ 50°C 10.40°C/W @ 200 LFM 34.00°C/W Aluminum Black Anodized
    342948-COPPER SKIVFIN

    342948-COPPER SKIVFIN

    342948,REV03(GP)

    Boyd Laconia, LLC

    2,193 -
    RFQ

    -

    - Bulk Active Board Level BGA, FPGA Push Pin, Thermal Material Rectangular, Fins 2.717" (69.00mm) 2.756" (70.00mm) - 0.551" (14.00mm) - - - Copper -
    2321B-TACHG

    2321B-TACHG

    THM,2321B-TACHG

    Boyd Laconia, LLC

    4,270 -
    RFQ

    -

    - Bulk Active Top Mount BGA Bolt On Rectangular, Pin Fins 1.701" (43.20mm) 1.626" (41.30mm) - 0.350" (8.89mm) - 6.93°C/W @ 200 LFM 22.10°C/W Aluminum Black Anodized
    7021B-8223-CL03G

    7021B-8223-CL03G

    THM,7021B-8223-CL03G

    Boyd Laconia, LLC

    1,774 -
    RFQ

    -

    - Bulk Active Board Level, Vertical TO-218, TO-220 Bolt On and PC Pin Rectangular, Fins 1.750" (44.45mm) 0.360" (9.14mm) - 1.450" (36.83mm) 6.0W @ 50°C 4.00°C/W @ 300 LFM 6.80°C/W Aluminum Black Anodized
    10-BRD1-03G

    10-BRD1-03G

    10-BRD1-03G

    Boyd Laconia, LLC

    3,061 -
    RFQ

    -

    - Bulk Active Top Mount BGA Solder Anchor Square, Pin Fins 1.476" (37.50mm) 1.476" (37.50mm) - 0.905" (23.00mm) - 3.83°C/W @ 200 LFM 10.10°C/W Aluminum Black Anodized
    374524B00023G

    374524B00023G

    306219 WITHOUT PAD,REV 00,00,04

    Boyd Laconia, LLC

    4,983 -
    RFQ

    -

    - Bulk Active Top Mount BGA, FPGA Thermal Tape, Adhesive (Included) Square, Pin Fins 1.063" (27.00mm) 1.063" (27.00mm) - 0.984" (25.00mm) 1.0W @ 20°C 5.00°C/W @ 250 LFM - Aluminum Black Anodized
    EH-160-H245G

    EH-160-H245G

    EH-160-H245, FG(GP)

    Boyd Laconia, LLC

    2,733 -
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - -
    KU-SBK-0381-ES-ST-0,3MM-SG

    KU-SBK-0381-ES-ST-0,3MM-SG

    KU-SBK-0381-ES-ST-0,3MM-SG

    Boyd Laconia, LLC

    1,716 -
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - -
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