HONG KONG HAOCHIP TRADING CO., LIMITED

    Heat Sinks

    制造商 Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material 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    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material Finish
    374924B00035G

    374924B00035G

    374924B00035G

    Boyd Laconia, LLC

    1,648 -
    RFQ

    -

    - Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Pin Fins 1.575" (40.00mm) 1.575" (40.00mm) - 0.394" (10.00mm) 3.0W @ 50°C 6.50°C/W @ 200 LFM 20.30°C/W Aluminum Black Anodized
    SW63-4G

    SW63-4G

    FG-HTSK-AL-000SW-63-B-PINS-ROHS

    Boyd Laconia, LLC

    3,870 -
    RFQ

    -

    - Bulk Active Board Level, Vertical TO-218, TO-220, TO-247 Bolt On and PC Pin Rectangular, Fins 1.358" (34.49mm) 0.492" (12.50mm) - 2.480" (62.99mm) 6.0W @ 60°C 5.00°C/W @ 200 LFM 7.00°C/W Aluminum Black Anodized
    KU-0334-AL-ST-1,2MM-3-A-VE-SG

    KU-0334-AL-ST-1,2MM-3-A-VE-SG

    KU-0334-AL-ST-1,2MM-3-A-VE-SG

    Boyd Laconia, LLC

    1,405 -
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - -
    342941-COPPER SKIVFIN

    342941-COPPER SKIVFIN

    342941,REV04(GP)

    Boyd Laconia, LLC

    2,417 -
    RFQ

    -

    - Bulk Active Board Level BGA, FPGA Push Pin, Thermal Material Rectangular, Fins 1.594" (40.50mm) 1.575" (40.00mm) - 0.531" (13.50mm) - - - Copper -
    6296BG PINS

    6296BG PINS

    HTSK-AL-16372-25.4-B-PINS-(ML97/

    Boyd Laconia, LLC

    2,872 -
    RFQ

    -

    - Bulk Active Board Level, Vertical TO-218, TO-220 Bolt On and PC Pin Rectangular, Fins 1.650" (41.91mm) 0.992" (25.20mm) - 1.000" (25.40mm) - - 5.23°C/W Aluminum Black Anodized
    530862B05162/MOD.HOLEG

    530862B05162/MOD.HOLEG

    202337-0002 REV B

    Boyd Laconia, LLC

    2,109 -
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - -
    10-6327-01G + T725 PAD

    10-6327-01G + T725 PAD

    10-6327-01G + T725 PAD

    Boyd Laconia, LLC

    4,929 -
    RFQ

    -

    - Bulk Active Board Level BGA, FPGA Push Pin Square, Pin Fins 1.122" (28.50mm) 1.122" (28.50mm) - 0.394" (10.00mm) 1.0W @ 30°C 8.00°C/W @ 300 LFM - Aluminum Black Anodized
    66100-2167

    66100-2167

    HEAT SINK(RD002371)66100-2167 RE

    Boyd Laconia, LLC

    1,318 -
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - -
    371924B00034G

    371924B00034G

    H/S ASS'Y 35*35*13.97MM PGA,3719

    Boyd Laconia, LLC

    2,805 -
    RFQ

    -

    - Bulk Active Top Mount BGA, FPGA Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.378" (35.00mm) 1.378" (35.00mm) - 0.550" (13.97mm) 3.0W @ 60°C 4.00°C/W @ 300 LFM - Aluminum Black Anodized
    3293-1

    3293-1

    3293-2,REV A(GP)

    Boyd Laconia, LLC

    1,072 -
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - -
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