HONG KONG HAOCHIP TRADING CO., LIMITED

    Heat Sinks

    制造商 Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material 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    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material Finish
    EA-170-H095-T710

    EA-170-H095-T710

    STD,EA-170-H095-T710, CLIP ATTAC

    Boyd Laconia, LLC

    3,671 -
    RFQ

    -

    EA-170 Bulk Active Top Mount BGA, FPGA Clip Square, Fins 0.669" (17.00mm) 0.669" (17.00mm) - 0.374" (9.50mm) - - - Aluminum Black Anodized
    KA40620028 REV 01

    KA40620028 REV 01

    KA40620028 REV 01

    Boyd Laconia, LLC

    1,928 -
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - -
    EA-190-H145-T710

    EA-190-H145-T710

    STD,EA-190-H145-T710, CLIP ATTAC

    Boyd Laconia, LLC

    1,651 -
    RFQ

    -

    EA-190 Bulk Active Top Mount BGA, FPGA Clip Square, Fins 0.748" (19.00mm) 0.748" (19.00mm) - 0.571" (14.50mm) - 19.70°C/W @ 200 LFM 50.80°C/W Aluminum Black Anodized
    533101B02551G

    533101B02551G

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    3,298 0.82
    RFQ
    533101B02551G

    Datasheet

    - Bulk Active Board Level, Vertical TO-218, TO-247 Clip and PC Pin Rectangular, Fins 1.500" (38.10mm) 1.375" (34.93mm) - 0.500" (12.70mm) 8.0W @ 80°C 3.00°C/W @ 500 LFM 11.00°C/W Aluminum Black Anodized
    364424B00032G

    364424B00032G

    HEATSINK BGA W/ADHESIVE TAPE

    Boyd Laconia, LLC

    2,254 -
    RFQ
    364424B00032G

    Datasheet

    - Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Pin Fins 1.579" (40.11mm) 1.575" (40.00mm) - 0.449" (11.40mm) 2.0W @ 40°C 6.00°C/W @ 200 LFM 18.40°C/W Aluminum Black Anodized
    513001B02500G

    513001B02500G

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    2,962 0.84
    RFQ
    513001B02500G

    Datasheet

    - Bulk Active Board Level, Vertical TO-218, TO-247 Bolt On and PC Pin Rectangular, Fins 1.000" (25.40mm) 1.375" (34.93mm) - 0.500" (12.70mm) 2.0W @ 30°C 4.00°C/W @ 400 LFM 13.40°C/W Aluminum Black Anodized
    574802B03700G

    574802B03700G

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    1,559 0.85
    RFQ
    574802B03700G

    Datasheet

    - Bulk Active Board Level, Vertical TO-220 Clip and PC Pin Rectangular, Fins 0.900" (22.86mm) 1.020" (25.91mm) - 0.420" (10.67mm) 3.0W @ 60°C 6.00°C/W @ 500 LFM 20.40°C/W Aluminum Black Anodized
    EA-190-H125-T710

    EA-190-H125-T710

    STD,EA-190-H125-T710, CLIP ATTAC

    Boyd Laconia, LLC

    3,038 -
    RFQ

    -

    EA-190 Bulk Active Top Mount BGA, FPGA Clip Square, Fins 0.748" (19.00mm) 0.748" (19.00mm) - 0.492" (12.50mm) - 22.50°C/W @ 200 LFM 54.80°C/W Aluminum Black Anodized
    EA-270-H095-T710

    EA-270-H095-T710

    STD,EA-270-H095-T710, CLIP ATTAC

    Boyd Laconia, LLC

    4,231 -
    RFQ

    -

    EA-270 Bulk Active Top Mount BGA, FPGA Clip Square, Fins 1.063" (27.00mm) 1.063" (27.00mm) - 0.374" (9.50mm) - 20.40°C/W @ 200 LFM 51.40°C/W Aluminum Black Anodized
    342000F00000G

    342000F00000G

    HEATSINK

    Boyd Laconia, LLC

    2,993 0.91
    RFQ
    342000F00000G

    Datasheet

    - Bulk Active - - - - - - - - - - - - -
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