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Solder
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Packaging | Product Status | Type | Composition | Diameter | Melting Point | Flux Type | Wire Gauge | Mesh Type | Process | Form | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
RC96L2031EAG3SAC 305 ROSIN FLUX 8 OZ. .031 DI Canfield Technologies |
3,219 | 40.72 |
|
- |
- | Spool | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | 423 ~ 424°F (217 ~ 218°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
CC96L2031ESAC 305 NO CLEAN FLUX 8 OZ .031 Canfield Technologies |
3,893 | 43.94 |
|
Datasheet |
- | Spool | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 20 AWG, 22 SWG | - | Lead Free | Spool, 1 lb (454 g) | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
WCBLF22701062BLF227 WATER SOLUBLE 1 LB. .062 Canfield Technologies |
3,034 | 44.80 |
|
- |
- | Spool | Active | Wire Solder | BLF 227 (99.17Sn/.8Cu/.03Ni) | 0.062" (1.57mm) | 440°F (227°C) | Water Soluble | 14 AWG, 16 SWG | - | Lead Free | Spool, 1 lb (453.59g) | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
WC96L2020PSAC 305 WATER SOLUBLE FLUX 8 OZ Canfield Technologies |
2,182 | 45.24 |
|
- |
- | Spool | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020" (0.51mm) | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | 24 AWG, 25 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
CC96L2020ESACSAC305 NO CLEAN FLUX 8 OZ .020 D Canfield Technologies |
1,244 | 45.24 |
|
- |
- | Spool | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020" (0.51mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 24 AWG, 25 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
WCBLF22701031BLF 227 WATER SOLUBLE FLUX 1 LB Canfield Technologies |
4,729 | 47.14 |
|
- |
- | Spool | Active | Wire Solder | BLF 227 (99.17Sn/.8Cu/.03Ni) | 0.031" (0.79mm) | 440°F (227°C) | Water Soluble | 20 AWG, 22 SWG | - | Lead Free | Spool, 1 lb (453.59g) | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
WCBLF22701020BLF 227 WATER SOLUBLE FLUX 1 LB. Canfield Technologies |
4,476 | 54.70 |
|
- |
- | Spool | Active | Wire Solder | BLF 227 (99.17Sn/.8Cu/.03Ni) | 0.020" (0.51mm) | 440°F (227°C) | Water Soluble | 24 AWG, 25 SWG | - | Lead Free | Spool, 1 lb (453.59g) | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
CCBLF22701020BLF 227 NO CLEAN FLUX 1 LB. .020 Canfield Technologies |
1,854 | 54.70 |
|
- |
- | Spool | Active | Wire Solder | BLF 227 (99.17Sn/.8Cu/.03Ni) | 0.020" (0.51mm) | 440°F (227°C) | No-Clean | 24 AWG, 25 SWG | - | Lead Free | Spool, 1 lb (453.59g) | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
CC9601062PSACSAC 305 NO CLEAN FLUX 1 LB .062 Canfield Technologies |
1,772 | - |
|
Datasheet |
- | Spool | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.062" (1.57mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 14 AWG, 16 SWG | - | Lead Free | Spool, 1 lb (454 g) | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
RC9601062PSACSAC 305 ROSIN FLUX 1 LB. 062 DIA Canfield Technologies |
3,926 | 69.06 |
|
- |
- | Spool | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.062" (1.57mm) | 423 ~ 424°F (217 ~ 218°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | - | Lead Free | Spool, 1 lb (453.59g) | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
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