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| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Packaging | Product Status | Type | Composition | Diameter | Melting Point | Flux Type | Wire Gauge | Mesh Type | Process | Form | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
WBNCSAC32LEAD FREE NO-CLEAN FLUX CORE SIL |
4,627 | 19.20 |
|
Datasheet |
- | Spool | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.032" (0.81mm) | 430°F (221°C) | No-Clean | 20 AWG, 21 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | - |
|
SMDSWLF.015 1LBLF SOLDER WIRE 96.5/3/0.5 TIN/SI |
2,111 | 19.39 |
|
Datasheet |
- | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015" (0.38mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 27 AWG, 28 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | - |
|
RASWLF.015 1LBLF SOLDER WIRE 96.5/3/0.5 TIN/SI |
4,875 | 19.39 |
|
Datasheet |
- | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015" (0.38mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 27 AWG, 28 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | - |
|
SMD2170SOLDER SPHERES SN63/PB37 .014" ( |
2,734 | 19.59 |
|
Datasheet |
SMD2 | Bulk | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.014" (0.36mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture | - |
|
4900-227GSOLDER LF SN96 21GAUGE .5LBS |
3,613 | 15.03 |
|
Datasheet |
4900 | Spool | Active | Wire Solder | Sn96.2Ag2.8Cu0.4 (96.2/2.8/0.4) | 0.032" (0.81mm) | 423 ~ 430°F (217 ~ 221°C) | No-Clean | 20 AWG, 21 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | 60 Months | Date of Manufacture | 50°F ~ 86°F (10°C ~ 30°C) |
|
TS991SNL500T3SOLDER PASTE THERMALLY STABLE NC |
3,359 | 21.44 |
|
Datasheet |
CHIPQUIK® | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | No-Clean | - | 3 | Lead Free | Jar, 17.64 oz (500g) | 12 Months | Date of Manufacture | - |
|
WS991AX500T4SOLDER PASTE THERMALLY STABLE WS |
1,170 | 21.15 |
|
Datasheet |
CHIPQUIK® | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 4 | Leaded | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | - |
|
SMD2150SOLDER SPHERES SN63/PB37 .010" ( |
3,721 | 20.79 |
|
Datasheet |
SMD2 | Bulk | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.010" (0.25mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture | - |
|
73299897SC C511 2% .064DIA 14AWG |
2,349 | 18.76 |
|
Datasheet |
C511™ | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.064" (1.63mm) | 423°F (217°C) | No-Clean | 14 AWG, 16 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | - |
|
SMDSWLF.059 3.3 1LBSOLDER WIRE SN96.5/AG3.0/CU0.5 |
1,589 | 21.44 |
|
Datasheet |
- | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.059" (1.50mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | - | Lead Free | Spool, 1 lb (453.59g) | - | - | - |
|
WS991LT500T4SOLDER PASTE THERMALLY STABLE WS |
1,089 | 19.42 |
|
Datasheet |
CHIPQUIK® | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | Water Soluble | - | 4 | Lead Free | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | - |
|
67383197SC 400 2% .048DIA 16AWG |
1,623 | 20.92 |
|
Datasheet |
C400 | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.048" (1.22mm) | 423°F (217°C) | No-Clean | 16 AWG, 18 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 59°F ~ 86°F (15°C ~ 30°C) |
|
SMD4300LTLFP250T4SOLDER PASTE SN42/BI57.6/AG0.4 |
2,339 | 21.36 |
|
Datasheet |
CHIPQUIK® SMD4300 | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 280°F (138°C) | No-Clean, Water Soluble | - | - | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture | 32°F ~ 77°F (0°C ~ 25°C) |
|
SMD3SWLT.040 100GSN42/BI58 2.2% FLUX CORE SOLDER |
4,366 | 23.65 |
|
Datasheet |
SMD3 | Bulk | Active | Wire Solder | Bi58Sn42 (58/42) | 0.040" (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | - | - | Lead Free | Spool, 3.53 oz (100g) | - | - | - |
|
TS391SNL500CTHERMALLY STABLE SOLDER PASTE NO |
4,629 | 23.99 |
|
Datasheet |
- | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Cartridge, 17.64 oz (500g) | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) |
|
SMD2040SOLDER SPHERES SAC305 .020 DIAM |
1,046 | 24.19 |
|
Datasheet |
SMD2 | Bulk | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020" (0.51mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture | - |
|
SMD2SWLT.040 100GSN42/BI57.6/AG0.4 2.2% FLUX CORE |
3,683 | 24.41 |
|
Datasheet |
SMD2 | Bulk | Active | Wire Solder | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 0.040" (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | - | - | Lead Free | Spool, 3.53 oz (100g) | - | - | - |
|
SMD2032SOLDER SPHERES SN96.5/AG3.0/CU0. |
2,346 | 24.59 |
|
Datasheet |
SMD2 | Bulk | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.016" (0.40mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture | - |
|
SMD2024SOLDER SPHERES SN96.5/AG3.0/CU0. |
3,592 | 24.99 |
|
Datasheet |
SMD2 | Bulk | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.012" (0.31mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture | - |
|
SMD2016SOLDER SPHERES SN96.5/AG3.0/CU0. |
2,698 | 25.39 |
|
Datasheet |
SMD2 | Bulk | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.008" (0.20mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture | - |
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