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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    44-3575-16

    44-3575-16

    CONN IC DIP SOCKET ZIF 44POS TIN

    Aries Electronics

    		 2,246 11.73
    RFQ
    		44-3575-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    44-6571-16

    44-6571-16

    CONN IC DIP SOCKET ZIF 44POS

    Aries Electronics

    		 1,731 11.73
    RFQ
    		44-6571-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    44-6572-16

    44-6572-16

    CONN IC DIP SOCKET ZIF 44POS TIN

    Aries Electronics

    		 4,919 11.73
    RFQ
    		44-6572-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    44-6573-16

    44-6573-16

    CONN IC DIP SOCKET ZIF 44POS TIN

    Aries Electronics

    		 2,404 11.73
    RFQ
    		44-6573-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    44-6574-16

    44-6574-16

    CONN IC DIP SOCKET ZIF 44POS TIN

    Aries Electronics

    		 4,263 11.73
    RFQ
    		44-6574-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    44-6575-16

    44-6575-16

    CONN IC DIP SOCKET ZIF 44POS TIN

    Aries Electronics

    		 1,102 11.73
    RFQ
    		44-6575-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    1011-1-0144-0B-00

    1011-1-0144-0B-00

    TEXTOOL1011-1-0144-0B-00

    3M

    		 3,723 -
    RFQ

    -

    		 - Bulk Active - - - - - - - - - - - - - - -
    558-10-456M26-001104

    558-10-456M26-001104

    BGA SURFACE MOUNT 1.27MM

    Preci-Dip

    		 2,310 11.33
    RFQ
    		558-10-456M26-001104

    Datasheet

         		558 Bulk Active BGA 456 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    40-3574-16

    40-3574-16

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    		 3,379 10.25
    RFQ
    		40-3574-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-6574-16

    40-6574-16

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    		 4,968 10.25
    RFQ
    		40-6574-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-3570-16

    40-3570-16

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    		 1,701 10.25
    RFQ
    		40-3570-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    40-3571-16

    40-3571-16

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    		 4,603 10.25
    RFQ
    		40-3571-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    40-3572-16

    40-3572-16

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    		 4,912 10.25
    RFQ
    		40-3572-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    40-3573-16

    40-3573-16

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    		 1,751 10.25
    RFQ
    		40-3573-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    40-3575-16

    40-3575-16

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    		 1,019 10.25
    RFQ
    		40-3575-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    1017-2-0256-0B-03

    1017-2-0256-0B-03

    TEXTOOLTEST & BURN-IN BALL GRID

    3M

    		 2,844 -
    RFQ

    -

    		 - Bulk Active - - - - - - - - - - - - - - -
    518-77-456M26-001105

    518-77-456M26-001105

    CONN SOCKET PGA 456POS GOLD

    Preci-Dip

    		 2,164 11.37
    RFQ
    		518-77-456M26-001105

    Datasheet

         		518 Bulk Active PGA 456 (26 x 26) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    48-3574-16

    48-3574-16

    CONN IC DIP SOCKET ZIF 48POS TIN

    Aries Electronics

    		 1,288 12.10
    RFQ
    		48-3574-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    48-6574-16

    48-6574-16

    CONN IC DIP SOCKET ZIF 48POS GLD

    Aries Electronics

    		 2,949 12.10
    RFQ
    		48-6574-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    121-PGM13012-10T

    121-PGM13012-10T

    CONN SOCKET PGA TIN

    Aries Electronics

    		 1,879 11.11
    RFQ
    		121-PGM13012-10T

    Datasheet

         		PGM Bulk Active PGA - 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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