HONG KONG HAOCHIP TRADING CO., LIMITED

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    518-77-357M19-001105

    518-77-357M19-001105

    CONN SOCKET PGA 357POS GOLD

    Preci-Dip

    1,772 8.70
    RFQ
    518-77-357M19-001105

    Datasheet

    518 Bulk Active PGA 357 (19 x 19) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    110-33-628-41-530000

    110-33-628-41-530000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    4,954 -
    RFQ

    -

    110 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-33-628-41-101000

    210-33-628-41-101000

    SOCKET IC CLOSED FRM .300 28POS

    Mill-Max Manufacturing Corp.

    2,456 -
    RFQ

    -

    210 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-33-316-41-001000

    210-33-316-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    4,417 -
    RFQ
    210-33-316-41-001000

    Datasheet

    210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Thermoplastic -55°C ~ 125°C
    110-33-316-41-001000

    110-33-316-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    1,717 -
    RFQ

    -

    - Tube Active - - - - - - - - - - - - - - -
    36-3551-16

    36-3551-16

    CONN IC DIP SOCKET ZIF 36POS

    Aries Electronics

    2,335 13.15
    RFQ
    36-3551-16

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    558-10-360M19-001104

    558-10-360M19-001104

    BGA SURFACE MOUNT 1.27MM

    Preci-Dip

    1,525 8.74
    RFQ
    558-10-360M19-001104

    Datasheet

    558 Bulk Active BGA 360 (19 x 19) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    518-77-352M26-001106

    518-77-352M26-001106

    CONN SOCKET PGA 352POS GOLD

    Preci-Dip

    3,618 8.94
    RFQ
    518-77-352M26-001106

    Datasheet

    518 Bulk Active PGA 352 (26 x 26) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    1109042

    1109042

    537 ZIF TEST SCKT LIVE BUG TYPE

    Aries Electronics

    4,517 13.20
    RFQ
    1109042

    Datasheet

    - - Active - - - - - - - - - - - - - - -
    514-83-432M31-001148

    514-83-432M31-001148

    CONN SOCKET BGA 432POS GOLD

    Preci-Dip

    2,731 9.47
    RFQ
    514-83-432M31-001148

    Datasheet

    514 Bulk Active BGA 432 (31 x 31) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    518-77-360M19-001105

    518-77-360M19-001105

    CONN SOCKET PGA 360POS GOLD

    Preci-Dip

    3,105 8.78
    RFQ
    518-77-360M19-001105

    Datasheet

    518 Bulk Active PGA 360 (19 x 19) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    514-87-560M33-001148

    514-87-560M33-001148

    CONN SOCKET BGA 560POS GOLD

    Preci-Dip

    2,332 9.81
    RFQ
    514-87-560M33-001148

    Datasheet

    514 Bulk Active BGA 560 (33 x 33) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    210-33-320-41-001000

    210-33-320-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    1,344 -
    RFQ

    -

    - Tube Active - - - - - - - - - - - - - - -
    518-77-356M26-001106

    518-77-356M26-001106

    CONN SOCKET PGA 356POS GOLD

    Preci-Dip

    2,725 9.05
    RFQ
    518-77-356M26-001106

    Datasheet

    518 Bulk Active PGA 356 (26 x 26) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    281-PGM18037-11

    281-PGM18037-11

    CONN SOCKET PGA GOLD

    Aries Electronics

    4,593 11.11
    RFQ
    281-PGM18037-11

    Datasheet

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    210-33-632-41-101000

    210-33-632-41-101000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,790 -
    RFQ
    210-33-632-41-101000

    Datasheet

    210 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-33-318-41-001000

    110-33-318-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    2,173 -
    RFQ

    -

    - Tube Active - - - - - - - - - - - - - - -
    210-33-318-41-001000

    210-33-318-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    4,494 -
    RFQ

    -

    - Tube Active - - - - - - - - - - - - - - -
    518-77-357M19-001106

    518-77-357M19-001106

    CONN SOCKET PGA 357POS GOLD

    Preci-Dip

    2,954 8.87
    RFQ
    518-77-357M19-001106

    Datasheet

    518 Bulk Active PGA 357 (19 x 19) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    558-10-388M26-001101

    558-10-388M26-001101

    PGA SOLDER TAIL 1.27MM

    Preci-Dip

    4,287 9.08
    RFQ
    558-10-388M26-001101

    Datasheet

    558 Bulk Active PGA 388 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
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