HONG KONG HAOCHIP TRADING CO., LIMITED

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    510-13-100-10-000001

    510-13-100-10-000001

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    3,130 7.06
    RFQ
    510-13-100-10-000001

    Datasheet

    510 Bulk Active PGA 100 (10 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    550-10-357M19-001166

    550-10-357M19-001166

    BGA PIN ADAPTER 1.27MM SMD

    Preci-Dip

    1,577 5.50
    RFQ
    550-10-357M19-001166

    Datasheet

    550 Bulk Active BGA 357 (19 x 19) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    APH-1338-G-R

    APH-1338-G-R

    APH-1338-G-R

    Samtec Inc.

    1,498 -
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1838-G-R

    APH-1838-G-R

    APH-1838-G-R

    Samtec Inc.

    1,758 -
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0938-G-R

    APH-0938-G-R

    APH-0938-G-R

    Samtec Inc.

    3,295 -
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1038-G-R

    APH-1038-G-R

    APH-1038-G-R

    Samtec Inc.

    2,204 -
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1938-G-R

    APH-1938-G-R

    APH-1938-G-R

    Samtec Inc.

    4,135 -
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0238-G-R

    APH-0238-G-R

    APH-0238-G-R

    Samtec Inc.

    1,065 -
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0838-G-R

    APH-0838-G-R

    APH-0838-G-R

    Samtec Inc.

    3,919 -
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0738-G-R

    APH-0738-G-R

    APH-0738-G-R

    Samtec Inc.

    3,399 -
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0438-G-R

    APH-0438-G-R

    APH-0438-G-R

    Samtec Inc.

    4,239 -
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1738-G-R

    APH-1738-G-R

    APH-1738-G-R

    Samtec Inc.

    1,999 -
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    514-83-419-19-001154

    514-83-419-19-001154

    CONN SOCKET PGA 419POS GOLD

    Preci-Dip

    4,277 6.03
    RFQ
    514-83-419-19-001154

    Datasheet

    514 Bulk Active PGA 419 (19 x 19) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-1008-G-2

    HLS-1008-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,389 -
    RFQ
    HLS-1008-G-2

    Datasheet

    HLS Bulk Active SIP 80 (10 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    510-13-101-13-061001

    510-13-101-13-061001

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    2,115 7.09
    RFQ
    510-13-101-13-061001

    Datasheet

    510 Bulk Active PGA 101 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    550-10-241-18-071101

    550-10-241-18-071101

    PGA SOLDER TAIL

    Preci-Dip

    2,410 6.12
    RFQ
    550-10-241-18-071101

    Datasheet

    550 Bulk Active PGA 241 (18 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-91-225-15-000003

    510-91-225-15-000003

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    4,706 7.11
    RFQ
    510-91-225-15-000003

    Datasheet

    510 Bulk Active PGA 225 (15 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    550-10-360M19-001166

    550-10-360M19-001166

    BGA PIN ADAPTER 1.27MM SMD

    Preci-Dip

    3,301 5.55
    RFQ
    550-10-360M19-001166

    Datasheet

    550 Bulk Active BGA 360 (19 x 19) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    24-6556-41

    24-6556-41

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    1,387 8.14
    RFQ
    24-6556-41

    Datasheet

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    APH-0840-G-H

    APH-0840-G-H

    APH-0840-G-H

    Samtec Inc.

    4,031 -
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
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