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IC Sockets
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
614-93-964-31-002000SKT CARRIER PGA |
1,023 | 4.26 |
|
Datasheet |
614 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
64-9503-20CONN IC DIP SOCKET 64POS GOLD |
3,469 | 5.48 |
|
Datasheet |
503 | Bulk | Active | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
116-43-314-61-007000CONN IC SKT DBL |
1,277 | 4.27 |
|
- |
116 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
116-93-314-61-007000CONN IC SKT DBL |
2,978 | 4.27 |
|
- |
116 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
110-93-318-61-105000CONN IC SKT DBL |
2,057 | 4.27 |
|
- |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
614-93-964-31-007000SOCKET CARRIER LOWPRO .900 64POS |
4,354 | 4.15 |
|
Datasheet |
614 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
614-43-964-31-007000SKT CARRIER PGA |
2,599 | 4.15 |
|
Datasheet |
614 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
40-3552-11CONN IC DIP SOCKET ZIF 40POS GLD |
2,932 | 5.57 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
|
40-3553-11CONN IC DIP SOCKET ZIF 40POS GLD |
1,864 | 5.57 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
|
40-6551-11CONN IC DIP SOCKET ZIF 40POS GLD |
3,527 | 5.57 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
|
40-6552-11CONN IC DIP SOCKET ZIF 40POS GLD |
3,041 | 5.57 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
|
40-6553-11CONN IC DIP SOCKET ZIF 40POS |
3,624 | 5.57 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
|
115-43-650-61-001000CONN IC SKT DBL |
3,997 | 4.72 |
|
- |
115 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 50 (2 x 25) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
612-43-650-41-004000SKT CARRIER SOLDRTL |
4,113 | 4.18 |
|
Datasheet |
612 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 50 (2 x 25) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
612-93-650-41-004000SKT CARRIER SOLDRTL |
3,575 | 4.18 |
|
Datasheet |
612 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 50 (2 x 25) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
24-6574-11CONN IC DIP SOCKET ZIF 24POS TIN |
4,535 | 4.20 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
|
24-3571-11CONN IC DIP SOCKET ZIF 24POS GLD |
2,954 | 4.20 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
|
24-3572-11CONN IC DIP SOCKET ZIF 24POS GLD |
4,163 | 4.20 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
|
24-3573-11CONN IC DIP SOCKET ZIF 24POS GLD |
2,954 | 4.20 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
|
24-3574-11CONN IC DIP SOCKET ZIF 24POS TIN |
1,283 | 4.20 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
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