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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    32-3553-11

    32-3553-11

    CONN IC DIP SOCKET ZIF 32POS GLD

    Aries Electronics

    		 3,256 4.67
    RFQ
    		32-3553-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-6551-11

    32-6551-11

    CONN IC DIP SOCKET ZIF 32POS GLD

    Aries Electronics

    		 1,484 4.67
    RFQ
    		32-6551-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-6552-11

    32-6552-11

    CONN IC DIP SOCKET ZIF 32POS GLD

    Aries Electronics

    		 4,653 4.67
    RFQ
    		32-6552-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-3554-11

    32-3554-11

    CONN IC DIP SOCKET ZIF 32POS GLD

    Aries Electronics

    		 1,814 4.67
    RFQ
    		32-3554-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    614-93-648-31-007000

    614-93-648-31-007000

    SOCKET CARRIER LOWPRO .600 48POS

    Mill-Max Manufacturing Corp.

    		 2,110 3.53
    RFQ
    		614-93-648-31-007000

    Datasheet

         		614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-648-31-007000

    614-43-648-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 4,109 3.53
    RFQ
    		614-43-648-31-007000

    Datasheet

         		614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICO-640-CGG

    ICO-640-CGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 1,217 -
    RFQ
    		ICO-640-CGG

    Datasheet

         		ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    104-13-642-41-780000

    104-13-642-41-780000

    CONN IC DIP SOCKET 42POS GOLD

    Mill-Max Manufacturing Corp.

    		 4,757 3.47
    RFQ
    		104-13-642-41-780000

    Datasheet

         		104 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
    APH-0534-T-R

    APH-0534-T-R

    APH-0534-T-R

    Samtec Inc.

    		 3,136 -
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1434-T-R

    APH-1434-T-R

    APH-1434-T-R

    Samtec Inc.

    		 4,410 -
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1034-T-R

    APH-1034-T-R

    APH-1034-T-R

    Samtec Inc.

    		 3,641 -
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1534-T-R

    APH-1534-T-R

    APH-1534-T-R

    Samtec Inc.

    		 3,978 -
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1134-T-R

    APH-1134-T-R

    APH-1134-T-R

    Samtec Inc.

    		 3,965 -
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    126-41-636-41-003000

    126-41-636-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,891 3.75
    RFQ
    		126-41-636-41-003000

    Datasheet

         		126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-91-636-41-003000

    126-91-636-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 1,563 3.75
    RFQ
    		126-91-636-41-003000

    Datasheet

         		126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    326-93-132-41-002000

    326-93-132-41-002000

    SOCKET WRAP SOLDERTAIL SIP 32POS

    Mill-Max Manufacturing Corp.

    		 2,140 3.58
    RFQ
    		326-93-132-41-002000

    Datasheet

         		326 Tube Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-640-41-001000

    116-93-640-41-001000

    CONN IC DIP SOCKET 40POS GOLD

    Mill-Max Manufacturing Corp.

    		 1,013 3.53
    RFQ
    		116-93-640-41-001000

    Datasheet

         		116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-640-41-001000

    116-43-640-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 1,646 3.53
    RFQ
    		116-43-640-41-001000

    Datasheet

         		116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-952-31-002000

    614-41-952-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 4,191 3.65
    RFQ
    		614-41-952-31-002000

    Datasheet

         		614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-952-31-002000

    614-91-952-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 3,017 3.65
    RFQ
    		614-91-952-31-002000

    Datasheet

         		614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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