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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    APH-0226-T-R

    APH-0226-T-R

    APH-0226-T-R

    Samtec Inc.

    		 1,034 -
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1326-T-R

    APH-1326-T-R

    APH-1326-T-R

    Samtec Inc.

    		 2,629 -
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0828-T-T

    APH-0828-T-T

    APH-0828-T-T

    Samtec Inc.

    		 1,042 -
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1628-T-T

    APH-1628-T-T

    APH-1628-T-T

    Samtec Inc.

    		 4,326 -
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1126-T-R

    APH-1126-T-R

    APH-1126-T-R

    Samtec Inc.

    		 1,503 -
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    123-13-422-41-801000

    123-13-422-41-801000

    CONN IC DIP SOCKET 22POS GOLD

    Mill-Max Manufacturing Corp.

    		 1,539 -
    RFQ
    		123-13-422-41-801000

    Datasheet

         		123 Tube Obsolete DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    32-6553-11

    32-6553-11

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    		 2,185 3.89
    RFQ
    		32-6553-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    110-41-320-61-001000

    110-41-320-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 1,310 3.35
    RFQ

    -

    		 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-320-61-001000

    110-43-320-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,995 3.35
    RFQ

    -

    		 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-320-61-001000

    110-91-320-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,047 3.35
    RFQ

    -

    		 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-432-31-018000

    614-41-432-31-018000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 4,250 3.34
    RFQ
    		614-41-432-31-018000

    Datasheet

         		614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-632-31-018000

    614-41-632-31-018000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 2,111 3.34
    RFQ
    		614-41-632-31-018000

    Datasheet

         		614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-432-31-018000

    614-91-432-31-018000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 4,803 3.34
    RFQ
    		614-91-432-31-018000

    Datasheet

         		614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-632-31-018000

    614-91-632-31-018000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 4,684 3.34
    RFQ
    		614-91-632-31-018000

    Datasheet

         		614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    714-93-132-31-012000

    714-93-132-31-012000

    SOCKET CARRIER SIP 32POS

    Mill-Max Manufacturing Corp.

    		 4,013 3.34
    RFQ
    		714-93-132-31-012000

    Datasheet

         		714 Tube Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    29-71250-10

    29-71250-10

    CONN SOCKET SIP 29POS TIN

    Aries Electronics

    		 1,010 3.71
    RFQ
    		29-71250-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 29 (1 x 29) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    29-7600-10

    29-7600-10

    CONN SOCKET SIP 29POS TIN

    Aries Electronics

    		 4,015 3.71
    RFQ
    		29-7600-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 29 (1 x 29) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    29-7625-10

    29-7625-10

    CONN SOCKET SIP 29POS TIN

    Aries Electronics

    		 4,043 3.71
    RFQ
    		29-7625-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 29 (1 x 29) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-6810-90

    20-6810-90

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    		 3,170 3.71
    RFQ
    		20-6810-90

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    116-41-650-41-006000

    116-41-650-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,720 3.08
    RFQ
    		116-41-650-41-006000

    Datasheet

         		116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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