HONG KONG HAOCHIP TRADING CO., LIMITED

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    116-91-432-41-008000

    116-91-432-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,052 3.33
    RFQ
    116-91-432-41-008000

    Datasheet

    116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-632-41-008000

    116-91-632-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,871 3.33
    RFQ
    116-91-632-41-008000

    Datasheet

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-642-41-003000

    116-41-642-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,196 3.37
    RFQ
    116-41-642-41-003000

    Datasheet

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-642-41-003000

    116-91-642-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,367 3.37
    RFQ
    116-91-642-41-003000

    Datasheet

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    36-6556-11

    36-6556-11

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    3,247 4.20
    RFQ
    36-6556-11

    Datasheet

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    605-93-328-11-480000

    605-93-328-11-480000

    SOCKET CARRIER LOWPRO .300 28POS

    Mill-Max Manufacturing Corp.

    1,136 3.32
    RFQ
    605-93-328-11-480000

    Datasheet

    605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-93-428-11-480000

    605-93-428-11-480000

    SOCKET CARRIER LOWPRO .400 28POS

    Mill-Max Manufacturing Corp.

    2,937 3.32
    RFQ
    605-93-428-11-480000

    Datasheet

    605 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-93-628-11-480000

    605-93-628-11-480000

    SOCKET CARRIER LOWPRO .600 28POS

    Mill-Max Manufacturing Corp.

    2,280 3.32
    RFQ
    605-93-628-11-480000

    Datasheet

    605 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-43-328-11-480000

    605-43-328-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    1,587 3.32
    RFQ
    605-43-328-11-480000

    Datasheet

    605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-43-428-11-480000

    605-43-428-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    4,099 3.32
    RFQ
    605-43-428-11-480000

    Datasheet

    605 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-43-628-11-480000

    605-43-628-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    2,732 3.32
    RFQ
    605-43-628-11-480000

    Datasheet

    605 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-93-322-41-002000

    126-93-322-41-002000

    CONN IC DIP SOCKET 22POS GOLD

    Mill-Max Manufacturing Corp.

    4,364 3.39
    RFQ
    126-93-322-41-002000

    Datasheet

    126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-93-422-41-002000

    126-93-422-41-002000

    CONN IC DIP SOCKET 22POS GOLD

    Mill-Max Manufacturing Corp.

    4,623 3.39
    RFQ
    126-93-422-41-002000

    Datasheet

    126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-43-322-41-002000

    126-43-322-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,025 3.39
    RFQ
    126-43-322-41-002000

    Datasheet

    126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-43-422-41-002000

    126-43-422-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,257 3.39
    RFQ
    126-43-422-41-002000

    Datasheet

    126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-11-316-41-001000

    123-11-316-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,211 3.20
    RFQ
    123-11-316-41-001000

    Datasheet

    123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-964-41-001000

    110-91-964-41-001000

    CONN IC DIP SOCKET 64POS GOLD

    Mill-Max Manufacturing Corp.

    4,284 3.22
    RFQ
    110-91-964-41-001000

    Datasheet

    110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-41-964-41-001000

    110-41-964-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,787 3.22
    RFQ
    110-41-964-41-001000

    Datasheet

    110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-41-964-41-001000

    210-41-964-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,084 3.22
    RFQ
    210-41-964-41-001000

    Datasheet

    210 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-91-964-41-001000

    210-91-964-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,058 3.22
    RFQ
    210-91-964-41-001000

    Datasheet

    210 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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