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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    APH-1612-G-H

    APH-1612-G-H

    APH-1612-G-H

    Samtec Inc.

    		 3,823 -
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1812-G-H

    APH-1812-G-H

    APH-1812-G-H

    Samtec Inc.

    		 2,031 -
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0312-G-H

    APH-0312-G-H

    APH-0312-G-H

    Samtec Inc.

    		 1,688 -
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    124-41-314-41-002000

    124-41-314-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 1,346 2.96
    RFQ
    		124-41-314-41-002000

    Datasheet

         		124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    124-91-314-41-002000

    124-91-314-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,667 2.96
    RFQ
    		124-91-314-41-002000

    Datasheet

         		124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-99-952-41-001000

    110-99-952-41-001000

    CONN IC DIP SOCKET 52POS TINLEAD

    Mill-Max Manufacturing Corp.

    		 2,297 2.90
    RFQ
    		110-99-952-41-001000

    Datasheet

         		110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-44-952-41-001000

    110-44-952-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,485 2.90
    RFQ
    		110-44-952-41-001000

    Datasheet

         		110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    104-11-320-41-780000

    104-11-320-41-780000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,533 2.91
    RFQ
    		104-11-320-41-780000

    Datasheet

         		104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    104-11-420-41-780000

    104-11-420-41-780000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,209 2.91
    RFQ
    		104-11-420-41-780000

    Datasheet

         		104 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    40-C182-11H

    40-C182-11H

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 2,450 3.70
    RFQ
    		40-C182-11H

    Datasheet

         		EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    64-9518-10H

    64-9518-10H

    CONN IC DIP SOCKET 64POS GOLD

    Aries Electronics

    		 4,621 3.19
    RFQ
    		64-9518-10H

    Datasheet

         		518 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    104-11-318-41-780000

    104-11-318-41-780000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,756 2.93
    RFQ
    		104-11-318-41-780000

    Datasheet

         		104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APO-316-G-R

    APO-316-G-R

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 2,919 -
    RFQ
    		APO-316-G-R

    Datasheet

         		APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    116-93-322-41-003000

    116-93-322-41-003000

    CONN IC DIP SOCKET 22POS GOLD

    Mill-Max Manufacturing Corp.

    		 1,327 2.95
    RFQ
    		116-93-322-41-003000

    Datasheet

         		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-422-41-003000

    116-93-422-41-003000

    CONN IC DIP SOCKET 22POS GOLD

    Mill-Max Manufacturing Corp.

    		 4,879 2.95
    RFQ
    		116-93-422-41-003000

    Datasheet

         		116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-322-41-003000

    116-43-322-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,415 2.95
    RFQ
    		116-43-322-41-003000

    Datasheet

         		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-422-41-003000

    116-43-422-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 1,436 2.95
    RFQ
    		116-43-422-41-003000

    Datasheet

         		116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-316-41-001000

    116-41-316-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,938 2.92
    RFQ
    		116-41-316-41-001000

    Datasheet

         		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-316-41-001000

    116-91-316-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,382 2.92
    RFQ
    		116-91-316-41-001000

    Datasheet

         		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-93-328-41-105000

    110-93-328-41-105000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,098 2.97
    RFQ
    		110-93-328-41-105000

    Datasheet

         		110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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