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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    APH-0328-T-R

    APH-0328-T-R

    APH-0328-T-R

    Samtec Inc.

    		 1,258 -
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1728-T-R

    APH-1728-T-R

    APH-1728-T-R

    Samtec Inc.

    		 4,985 -
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0828-T-R

    APH-0828-T-R

    APH-0828-T-R

    Samtec Inc.

    		 4,154 -
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1328-T-R

    APH-1328-T-R

    APH-1328-T-R

    Samtec Inc.

    		 4,815 -
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    117-47-430-41-005000

    117-47-430-41-005000

    STANDRD SOLDRTL

    Mill-Max Manufacturing Corp.

    		 2,614 2.89
    RFQ
    		117-47-430-41-005000

    Datasheet

         		117 Tube Active DIP, 0.4" (10.16mm) Row Spacing 30 (2 x 15) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-93-158-41-013000

    346-93-158-41-013000

    CONN SOCKET SIP 58POS GOLD

    Mill-Max Manufacturing Corp.

    		 1,624 2.12
    RFQ
    		346-93-158-41-013000

    Datasheet

         		346 Bulk Active SIP 58 (1 x 58) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-43-158-41-013000

    346-43-158-41-013000

    CONN SOCKET SIP 58POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,280 2.12
    RFQ
    		346-43-158-41-013000

    Datasheet

         		346 Bulk Active SIP 58 (1 x 58) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    18-820-90

    18-820-90

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    		 2,529 3.67
    RFQ
    		18-820-90

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    18-822-90

    18-822-90

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    		 1,805 3.67
    RFQ
    		18-822-90

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    26-8450-310C

    26-8450-310C

    CONN IC DIP SOCKET 26POS GOLD

    Aries Electronics

    		 4,437 3.67
    RFQ
    		26-8450-310C

    Datasheet

         		8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    26-8500-310C

    26-8500-310C

    CONN IC DIP SOCKET 26POS GOLD

    Aries Electronics

    		 3,772 3.67
    RFQ
    		26-8500-310C

    Datasheet

         		8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    111-41-642-41-001000

    111-41-642-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,548 2.90
    RFQ
    		111-41-642-41-001000

    Datasheet

         		111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-91-642-41-001000

    111-91-642-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,425 2.90
    RFQ
    		111-91-642-41-001000

    Datasheet

         		111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-320-41-001000

    614-41-320-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 1,482 2.88
    RFQ
    		614-41-320-41-001000

    Datasheet

         		614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-420-41-001000

    614-41-420-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 3,134 2.88
    RFQ
    		614-41-420-41-001000

    Datasheet

         		614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-320-41-001000

    614-91-320-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 2,224 2.88
    RFQ
    		614-91-320-41-001000

    Datasheet

         		614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-420-41-001000

    614-91-420-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 4,720 2.88
    RFQ
    		614-91-420-41-001000

    Datasheet

         		614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APO-640-T-H

    APO-640-T-H

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 3,929 -
    RFQ
    		APO-640-T-H

    Datasheet

         		APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    123-13-210-41-001000

    123-13-210-41-001000

    CONN IC DIP SOCKET 10POS GOLD

    Mill-Max Manufacturing Corp.

    		 4,484 2.59
    RFQ
    		123-13-210-41-001000

    Datasheet

         		123 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-41-636-41-117000

    114-41-636-41-117000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 1,632 2.90
    RFQ
    		114-41-636-41-117000

    Datasheet

         		114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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    Kyle@hkhaochip.com